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3-D MID

ServiceErlangen, GermanyFounded 1992· One of 1986 Service companies tracked by AMPulse

Industry research association advancing Mechatronic Integrated Devices (MID) technology, enabling 3D functionalized plastic components via additive manufacturing, laser direct structuring, and printed electronics.

CEO / Founder
Prof. Dr. Franke (Chairman)
Team Size
11-50
Stage
Active
Latest Round
Grant

Technology & Products

Key Products

MID Technology Research; International MID Congress; Joint R&D Projects; Standardization & Guidelines

Technological Advantage

CLAIMED: Centralized R&D hub for MID technology with access to Fraunhofer, university labs, and member companies. VERIFIED: Long-standing industry network (since 1992), organizes international MID Congress, drives standardization. DEFENSIBLE: Network/consortium model, not easily replicable by single entities.

Differentiation

Value Proposition

Reduces R&D costs and time-to-market for 3D circuit carriers by pooling pre-competitive research, standardizing MID processes, and providing direct access to academic and industrial expertise, avoiding redundant internal development.

How They Differentiate

Unlike commercial hardware vendors, 3-D MID operates as a pre-competitive research association, focusing on standardization, joint R&D projects, and knowledge transfer rather than selling printers or materials.

Market & Competition

Target Customers

Electronics manufacturers, automotive OEMs, medical device companies, and research institutes

Industry Verticals

Automotive; Medical Technology; Consumer Electronics; Telecommunications

Competitors

LPKF Laser & Electronics; HARTING Technology Group

Growth & Milestones

Growth Metrics

The research association hosts events like the MID Summit & MID Workshop in October 2024 and the International MID Congress, with about 150 participants at the 3rd China-Europe MID Technology Exchange Conference, and organizes joint booths at trade fairs such as electronica 2022.

Major Milestones

Founded in 1992 in Erlangen; Renamed from Molded Interconnect Devices to Mechatronic Integrated Devices in 2010; Hosts annual International MID Congress