APES
Develops modular adaptive additive manufacturing platforms (Matrix6D) and offers end-to-end solutions for additively manufactured electronics (AME), enabling high-mix, low-volume production of 3D circuits, sensors, and advanced semiconductor packaging.
- CEO / Founder
- Dr. Rich Neill
- Team Size
- 1-10
- Stage
- Growth Stage
- Total Funding
- $2.5M
- Latest Round
- Seed
- Key Investors
- SOSV; HAX; Newlab; NYC EDC
Technology & Products
Key Products
Matrix6D modular adaptive additive manufacturing platform; AION-5X system; KRONOS Helios and Hyperion AME systems (via partnership); End-to-end software solution (CAD, multi-tool cloud integration, platform middleware)
Technological Advantage
Proprietary modular platform (Matrix6D) combines multiple additive and potentially hybrid manufacturing processes into a single, flexible system tailored for electronics. This hardware-centric approach addresses the semiconductor industry's need for precise z-axis integration in chiplet-based designs. The advantage is protected through strategic partnerships (e.g., KRONOS, IDS) that expand its technology portfolio and application reach, though core IP defensibility is not publicly detailed.
Differentiation
Value Proposition
Reduces time-to-market and capital expenditure for advanced semiconductor packaging and 3D printed electronics by providing a flexible, modular hardware platform that integrates into existing workflows, enabling a Fab-as-a-Service (FaaS) model for high-mix, low-volume production.
How They Differentiate
Focuses on a modular, multi-process platform (Matrix6D) for scalable electronics production, contrasting with competitors' more specialized single-technology systems (e.g., Nano Dimension's DragonFly for PCB prototyping, Optomec's Aerosol Jet for conformal printing). APES's strategy integrates hardware with partnerships to offer a broader 'factory' solution for advanced semiconductor packaging.
Market & Competition
Target Customers
Semiconductor manufacturers, electronics OEMs, advanced packaging foundries, and R&D institutions requiring agile, on-demand production of complex electronic components.
Industry Verticals
Semiconductor; Electronics; Advanced Packaging; Aerospace & Defense; Medical Devices
Competitors
Nano Dimension; Optomec; Neotech AMT
Growth & Milestones
Growth Metrics
Launched Matrix6D platform in 2023; secured initial customers in aerospace and medical device sectors; team grew from 5 to 15+ employees in 2024.
Major Milestones
Launch of Matrix6D modular platform (2026); Strategic partnership with Great Lakes Semiconductor for Fab-as-a-Service model (2026); Partnership with KRONOS Mechatronics to offer Helios/Hyperion AME systems (2026); Partnership with IDS for NanoJet technology integration; Demonstration at RAPID + TCT 2026
Notable Customers
Great Lakes Semiconductor