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Bairou New Material

MaterialsShenzhen, ChinaFounded 2017· One of 884 Materials companies tracked by AMPulse

A high-tech material science company specializing in 3D-printed electronic functional materials and additive manufacturing solutions for PCBs, semiconductors, and lithium batteries.

CEO / Founder
Hu Junhui
Team Size
100-500
Stage
Active
Total Funding
$16.0M
Latest Round
Series B
Key Investors
Yueke Finance (粤科金融), Shangkai Venture Capital (尚颀资本), Das Capital (大一资本), Shenzhen High-tech Investment (深圳高新投)

Technology & Products

Key Products

["Micro-nano Composite Copper Slurry (for high-precision via filling)","High-Temperature Sintering Silver/Copper Conductive Pastes","Inkjet-printable Dielectric and Conductive Inks for PCBs","C-FL Non-Fluorine Lithium Battery Separator Coating Materials","TGV (Through Glass Via) and TSV (Through Silicon Via) Packaging Materials","Photovoltaic Metallization Pastes"]

Technological Advantage

Proprietary nano-glass and high-purity metal nanomaterial synthesis allows for sintering at lower temperatures while maintaining high bonding strength on difficult substrates like glass and ceramics, outperforming traditional sputtering methods.

Differentiation

Value Proposition

Replaces traditional 'subtractive' chemical etching and electroplating with an eco-friendly 'additive' printing process, reducing waste, lowering equipment costs, and achieving superior adhesion (5 N/mm²) on glass and ceramic substrates.

How They Differentiate

Bairou differentiates by replacing traditional 'subtractive' chemical etching with a proprietary 'additive' printing process. Their micro-nano composite copper slurry achieves superior adhesion (5 N/mm²) on difficult substrates like ceramics and glass compared to traditional sputtering (1-2 N/mm²), while significantly reducing chemical waste and equipment costs.

Market & Competition

Target Customers

Advanced PCB manufacturers, semiconductor packaging firms (TGV/TSV), lithium-ion battery producers, and photovoltaic cell manufacturers.

Industry Verticals

["PCB & Advanced Electronics Manufacturing","Semiconductor Packaging","Renewable Energy (Photovoltaics)","Electric Vehicle (EV) Batteries","Consumer Electronics"]

Competitors

Jiangsu Boqian New Materials (博迁新材); Guangdong Shengyi Technology (生益科技); Suzhou NanoMicro Technology (纳微科技)

Growth & Milestones

Growth Metrics

Achieved National 'Little Giant' (专精特新) status in 2025; holds over 50 national invention patents and maintains an R&D team of over 50 specialists.

Major Milestones

["2017: Company founded in Shenzhen.","2019: Certified as a National High-Tech Enterprise.","2021: Recognized as a Shenzhen 'Specialized, Refined, Differential, Innovative' SME.","2024-10: Successfully closed ¥50M Series A funding.","2025-03: Secured ¥65M Series B funding to scale 3D-printed electronic materials production."]

Notable Customers

Mingyang Circuit (明阳电路); Strategic partners in the high-precision PCB and semiconductor packaging sectors