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Bairou New Material

MaterialsShenzhen, ChinaFounded 2017· One of 955 Materials companies tracked by AMPulse

A high-tech material science company specializing in 3D-printed electronic functional materials and additive manufacturing solutions for PCBs, semiconductors, and lithium batteries.

CEO / Founder
Hu Junhui
Team Size
201-500
Stage
Active
Total Funding
$16.0M
Latest Round
Series B
Key Investors
Yueke Finance (粤科金融), Shangkai Venture Capital (尚颀资本), Das Capital (大一资本), Shenzhen High-tech Investment (深圳高新投)

Technology & Products

Key Products

Bairou New Material specializes in 3D printing electronic functional materials and additive manufacturing solutions. Their applications include Via Plugging & Interconnection, PCB 3D Inkjet Printing, Line Complement, and Flexible Film Electronics Printing.

Technological Advantage

Proprietary nano-glass and high-purity metal nanomaterial synthesis allows for sintering at lower temperatures while maintaining high bonding strength on difficult substrates like glass and ceramics, outperforming traditional sputtering methods.

Differentiation

Value Proposition

Replaces traditional 'subtractive' chemical etching and electroplating with an eco-friendly 'additive' printing process, reducing waste, lowering equipment costs, and achieving superior adhesion (5 N/mm²) on glass and ceramic substrates.

How They Differentiate

Bairou differentiates by replacing traditional 'subtractive' chemical etching with a proprietary 'additive' printing process. Their micro-nano composite copper slurry achieves superior adhesion (5 N/mm²) on difficult substrates like ceramics and glass compared to traditional sputtering (1-2 N/mm²), while significantly reducing chemical waste and equipment costs.

Market & Competition

Target Customers

Advanced PCB manufacturers, semiconductor packaging firms (TGV/TSV), lithium-ion battery producers, and photovoltaic cell manufacturers.

Industry Verticals

["PCB & Advanced Electronics Manufacturing","Semiconductor Packaging","Renewable Energy (Photovoltaics)","Electric Vehicle (EV) Batteries","Consumer Electronics"]

Competitors

Jiangsu Boqian New Materials (博迁新材); Guangdong Shengyi Technology (生益科技); Suzhou NanoMicro Technology (纳微科技)

Growth & Milestones

Growth Metrics

Achieved National 'Little Giant' (专精特新) status in 2025; holds over 50 national invention patents and maintains an R&D team of over 50 specialists.

Major Milestones

["2017: Company founded in Shenzhen.","2019: Certified as a National High-Tech Enterprise.","2021: Recognized as a Shenzhen 'Specialized, Refined, Differential, Innovative' SME.","2024-10: Successfully closed ¥50M Series A funding.","2025-03: Secured ¥65M Series B funding to scale 3D-printed electronic materials production."]

Notable Customers

Mingyang Circuit (明阳电路); Strategic partners in the high-precision PCB and semiconductor packaging sectors

https://www.baroy.com.cn

Why this company matters

Bairou New Material occupies a niche at the intersection of additive manufacturing and electronics fabrication. The company replaces traditional subtractive processes—chemical etching and electroplating—with a dry additive printing method that deposits conductive circuits directly onto substrates. This approach reduces chemical waste, lowers equipment costs, and achieves adhesion of 5 N/mm² on glass and ceramic substrates, compared to 1-2 N/mm² for conventional sputtering.

Core to Bairou's offering is a proprietary micro-nano composite copper slurry and nano-glass synthesis that enables low-temperature sintering while maintaining high bond strength. The company's technology targets via plugging and interconnection, PCB 3D inkjet printing, line complement, and flexible film electronics printing. Applications span advanced PCB manufacturing, semiconductor packaging (TGV/TSV), lithium-ion battery production, and photovoltaic cells.

Bairou holds over 50 national invention patents and three international PCT patents focused on nanomaterial preparation and additive manufacturing for electronics. The company achieved National 'Little Giant' status in 2025 and has raised approximately $16 million from investors including Yueke Finance, Shangkai Venture Capital, Das Capital, and Shenzhen High-tech Investment. Key partners include Mingyang Circuit as an industrial application partner, along with Huazhong University of Science and Technology and Shenzhen University for R&D.

Competitors include Jiangsu Boqian New Materials, Guangdong Shengyi Technology, and Suzhou NanoMicro Technology. Bairou's differentiation rests on its dry additive process, which avoids the interface stress and chemical erosion inherent in traditional plating. The open question is whether the company can scale production to meet the volume requirements of large PCB and semiconductor packaging customers while maintaining the material consistency that the electronics industry demands.