Curiteva
Develops proprietary fused strand deposition (FSD) 3D printers and bioactive nano-surface technology to manufacture FDA-cleared Trabecular PEEK spinal implants, enabling osseointegration and reducing patient recovery times.
- CEO / Founder
- Mike English
- Team Size
- 51-200
- Stage
- Active
- Total Funding
- $32.5M
- Latest Round
- Series A - $20.5M - December 2020
- Key Investors
- Eastside Partners
Technology & Products
Key Products
Inspire Technology Platform for 3D printed PEEK spinal implants with bioactive nano-surface technology.
Technological Advantage
Patented FSD technology allows full control over implant porosity and structure, protected by FDA Master File and patents; HAFUSE surface technology is exclusive through partnership with Promimic, creating a regulatory and IP moat.
Differentiation
Value Proposition
Reduces spinal implant production costs by controlling the entire manufacturing process in-house, while offering a bioactive PEEK implant that enhances bone growth and reduces revision surgeries compared to traditional implants.
How They Differentiate
3x faster build speed and 30% lower cost-per-part for PEEK spinal implants compared to traditional manufacturing, with exclusive bioactive surface technology that competitors lack.
Market & Competition
Target Customers
Orthopedic surgeons and hospitals for spinal fusion procedures
Industry Verticals
Medical Devices; Orthopedics; Spine Surgery
Competitors
Innovasis; TranS1; 3D Systems
Growth & Milestones
Growth Metrics
60% growth in surgeries and 90% increase in surgeon customers over the past year; surpassed 10,000 levels successfully treated with Inspire implants.
Major Milestones
FDA 510(k) clearance for Inspire Porous PEEK Cervical Interbody System (2023); Acquisition of FossiLabs (2020); FDA nanotechnology designation for Inspire implants (2026); First US surgeries with Evonik-powered implants (April 2024); Expanded partnership with Promimic (May 2025)
Notable Customers
Surgeons and hospitals, with over 10,000 levels successfully treated.