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Great Lakes Semiconductor

ServiceFishkill, NY, USAFounded 2021· One of 1986 Service companies tracked by AMPulse

Provides semiconductor fabrication and Fab-as-a-Service (FaaS) integrated with additive manufactured electronics (AME) for advanced packaging, enabling rapid, low-to-high volume production of embedded chips in 3D structures.

CEO / Founder
Rich Neill
Team Size
11-50
Stage
Active
Total Funding
$5M
Latest Round
Seed
Key Investors
Empire State Development; New York Ventures; Private investors

Technology & Products

Key Products

Great Lakes Semiconductor (GLS) focuses on developing world-class semiconductor fabrication facilities. They leverage advanced computational AI and Large Language Models (LLM) for predicting demand fluctuations and improving supply chain transparency. GLS also incorporates the APES Matrix6D platform for advanced semiconductor packaging and offers a Fab-as-a-Service (FaaS) model.

Technological Advantage

Proprietary ChipForge platform and FaaS model enable flexible, scalable semiconductor production with AME integration, protected by trade secrets and strategic IP in advanced packaging.

Differentiation

Value Proposition

Reduces electronic footprints by 50% and enables localized production through modular ChipForge platform and FaaS model, cutting lead times from months to weeks for prototype-to-production semiconductor devices.

How They Differentiate

Offers integrated AME capabilities and FaaS model for rapid prototyping and small-lot production, unlike traditional foundries focused on high-volume 2D manufacturing, with 50% smaller electronic footprints.

Market & Competition

Target Customers

Semiconductor companies, electronics manufacturers, and industries requiring custom integrated circuits and sensors

Industry Verticals

Semiconductor; Electronics; Aerospace; Defense; Automotive

Competitors

TSMC; Intel Foundry Services; Samsung Foundry

Growth & Milestones

Growth Metrics

Launched first commercial FaaS offering in 2023; expanding to 10,000 sq ft facility in Fishkill, NY

Major Milestones

Partnership with APES to integrate semiconductor manufacturing with additive manufactured electronics (AME); Establishment of FaaS model for flexible production capacity

https://greatlakessemiconductor.com

Recent coverage of Great Lakes Semiconductor

Why this company matters

Great Lakes Semiconductor (GLS) occupies a niche between traditional semiconductor foundries and additive manufacturing by combining Fab-as-a-Service (FaaS) with additive manufactured electronics (AME). Its ChipForge platform enables rapid, low-to-high volume production of embedded chips in 3D structures, targeting applications where conventional 2D packaging is too large or supply chains are too rigid.

The core technology integrates semiconductor fabrication steps with AME via the APES Matrix6D platform, allowing active chips to be embedded directly into additively built interconnects and substrates. GLS also uses AI and large language models to predict demand fluctuations and improve supply chain transparency. The FaaS model lets customers prototype and produce custom integrated circuits and sensors without committing to a dedicated fab.

GLS serves semiconductor companies, electronics manufacturers, and aerospace, defense, and automotive customers needing custom ICs and sensors with smaller footprints. The company launched its first commercial FaaS offering in 2023 and is expanding to a 10,000 sq ft facility in Fishkill, NY. It has raised $5 million from Empire State Development, New York Ventures, and private investors.

GLS differentiates from TSMC, Intel Foundry Services, and Samsung Foundry by offering integrated AME and flexible small-lot production rather than high-volume 2D manufacturing. Its strategic IP in advanced packaging and trade secrets around the ChipForge platform provide a moat, but scaling beyond niche prototype runs will require proving reliability and cost parity with traditional foundries for higher volumes.