Great Lakes Semiconductor
Provides semiconductor fabrication and Fab-as-a-Service (FaaS) integrated with additive manufactured electronics (AME) for advanced packaging, enabling rapid, low-to-high volume production of embedded chips in 3D structures.
- CEO / Founder
- Rich Neill
- Stage
- Active
- Total Funding
- $5M
- Latest Round
- Seed
- Key Investors
- Empire State Development; New York Ventures; Private investors
Technology & Products
Key Products
Great Lakes Semiconductor (GLS) focuses on developing world-class semiconductor fabrication facilities. They leverage advanced computational AI and Large Language Models (LLM) for predicting demand fluctuations and improving supply chain transparency. GLS also incorporates the APES Matrix6D platform for advanced semiconductor packaging and offers a Fab-as-a-Service (FaaS) model.
Technological Advantage
Proprietary ChipForge platform and FaaS model enable flexible, scalable semiconductor production with AME integration, protected by trade secrets and strategic IP in advanced packaging.
Differentiation
Value Proposition
Reduces electronic footprints by 50% and enables localized production through modular ChipForge platform and FaaS model, cutting lead times from months to weeks for prototype-to-production semiconductor devices.
How They Differentiate
Offers integrated AME capabilities and FaaS model for rapid prototyping and small-lot production, unlike traditional foundries focused on high-volume 2D manufacturing, with 50% smaller electronic footprints.
Market & Competition
Target Customers
Semiconductor companies, electronics manufacturers, and industries requiring custom integrated circuits and sensors
Industry Verticals
Semiconductor; Electronics; Aerospace; Defense; Automotive
Competitors
TSMC; Intel Foundry Services; Samsung Foundry
Growth & Milestones
Growth Metrics
Launched first commercial FaaS offering in 2023; expanding to 10,000 sq ft facility in Fishkill, NY
Major Milestones
Partnership with APES to integrate semiconductor manufacturing with additive manufactured electronics (AME); Establishment of FaaS model for flexible production capacity