Heatflow
A thermal management startup developing 3D-printed passive two-phase cooling solutions (thermosiphons) to eliminate energy-intensive fans and pumps in high-power electronics.
- CEO / Founder
- Paw Fallgaard Mortensen
- Team Size
- 2-10
- Stage
- Commercialization phase following successful industrial pilots (e.g., AM2PC and GreenDC projects) with strategic European partners.
- Total Funding
- $1.2M
- Latest Round
- Grant
- Key Investors
- ["Innovation Fund Denmark","Danish AM Hub","Energy Cluster Denmark"]
Technology & Products
Key Products
["Patent-pending High-Efficiency Thermosiphons","Metal Additively Manufactured (AM) Heat Sinks","Compact Gas-to-Gas Heat Exchangers","Custom Two-Phase Thermal Management Systems"]
Technological Advantage
Passive 'gravity-driven' operation eliminates moving parts (pumps/fans), significantly increasing system lifespan and reliability while achieving heat transfer coefficients comparable to active liquid cooling.
Market & Competition
Target Customers
Data center operators, electric vehicle (EV) manufacturers, telecommunications infrastructure providers, and aerospace companies.
Industry Verticals
["Data Centers & High-Performance Computing","Automotive (Electric Vehicles)","Telecommunications","Aerospace & Space","Power Electronics"]
Competitors
["Conflux Technology","Submer","Wieland Microcool"]