Kupros
Develops Cu29, an all-metal conductive copper filament for standard FDM 3D printers, enabling 3D printed electronics, sensors, and antennas.
- CEO / Founder
- Ian Ramsdell
- Team Size
- 1-10
- Stage
- Active
- Total Funding
- $10K
- Latest Round
- Accelerator
- Key Investors
- Spark Cleantech Accelerator
Technology & Products
Key Products
Cu-29 All-Metal Conductive Filament; Cu29 Space (in development)
Technological Advantage
Proprietary copper-based nanomaterial formulation achieves high conductivity and solderability; technology developed through DoD National Security Innovation Network program.
Differentiation
Value Proposition
Enables low-cost prototyping and production of functional electronics using existing desktop FDM printers, reducing barriers to additive electronics manufacturing.
How They Differentiate
Focuses on filament-based approach for desktop FDM printers vs. competitors' specialized inkjet or aerosol jet systems; offers lower cost of entry (<$1,000 vs. $350,000+ systems).
Market & Competition
Target Customers
Electronics manufacturers, aerospace/defense contractors, R&D labs
Industry Verticals
Aerospace; Defense; Electronics
Competitors
Nano Dimension; Optomec; Voxel8
Growth & Milestones
Major Milestones
Launched Cu29 filament (2021); Participated in Spark Cleantech Accelerator (2025); Reported pre-sales to major clients including KBR, Northrop Grumman, NASA, Boeing, DEVCOM
Notable Customers
nScrypt