MULTI3D
Develops highly conductive filaments and polymers for 3D printing electronics like antennas and sensors without soldering.
- CEO / Founder
- Allen Gray
- Team Size
- 1-10
- Stage
- Active
- Total Funding
- $1.35M
- Latest Round
- Grant
- Key Investors
- National Science Foundation (NSF); NASA; U.S. Department of Energy (DOE); One North Carolina Small Business Program
Technology & Products
Key Products
Electrifi Conductive Filament, Electrifi Conductive PE, Electrifi Conductive Pellets, Colloidal Silver Liquid
Technological Advantage
Proprietary material formulation enables direct printing of functional RF components and circuits, eliminating the need for secondary conductive coatings or soldering.
Differentiation
Value Proposition
Reduces electronics prototyping complexity by enabling solderless assembly with 100x higher conductivity (0.006 Ω cm) than standard 3D printing filaments.
How They Differentiate
Achieves 100x higher conductivity (0.006 Ω cm) than standard conductive filaments, allowing for functional electronics fabrication without soldering.
Market & Competition
Target Customers
Makers, hobbyists, and electronics prototyping/manufacturing firms.
Industry Verticals
Electronics; Wearables; RF components; Sensors
Competitors
Boston Materials, Interface Polymers, Evantic
Growth & Milestones
Growth Metrics
Received over $1.1M in federal and state research grants; Team size of approximately 5 employees
Major Milestones
Debut at Burlington Mini Maker Faire (April 23, 2016)
Notable Customers
NASA; U.S. Air Force