Syenta
Develops Localized Electrochemical Manufacturing (LEM) systems, an additive process that deposits conductive materials at micron-scale to create high-density chip-to-chip interconnects for AI and semiconductor packaging.
- CEO / Founder
- Jekaterina Viktorova
- Team Size
- 11-50
- Stage
- Growth Stage
- Total Funding
- $37M
- Latest Round
- Series A
- Key Investors
- Playground Global; National Reconstruction Fund Corporation (Australian Government); Investible; Blackbird Ventures; Jelix Ventures; Salus Ventures; Wollemi Capital
Technology & Products
Key Products
LEM (Localized Electrochemical Manufacturing) tool
Technological Advantage
Proprietary LEM technology achieves high-density interconnects at finer pitches than traditional methods, protected by patents and verified as an electrochemical additive manufacturing tool for scalable electronics production. Core IP is defensible; process advantage targets integration into existing fabs, creating potential switching costs.
Differentiation
Value Proposition
Reduces semiconductor packaging steps by 40%, enabling finer-pitch, higher-bandwidth interconnects to overcome AI's data movement bottleneck and integrate into existing manufacturing infrastructure.
How They Differentiate
LEM is an additive, electrochemical process enabling 3D multi-material printing of interconnects, versus TSMC's lithography-based packaging and ASMPT's traditional deposition equipment. Claims 40% fewer manufacturing steps and compatibility with existing infrastructure.
Market & Competition
Target Customers
Semiconductor foundries, OSATs (Outsourced Semiconductor Assembly and Test), AI hardware manufacturers
Industry Verticals
Semiconductor; AI Hardware; Electronics Manufacturing
Competitors
TSMC (InFO, CoWoS technologies); ASMPT (advanced packaging equipment)
Growth & Milestones
Growth Metrics
Secured $37M in funding to scale from ANU research toward commercial production, opened first U.S. facility in Tempe, Arizona.
Major Milestones
Spun out from ANU (2022); Secured $3.7M Seed round (2022); Raised $8.8M Pre-Series A (2025); Closed $26M Series A (2026); Announced $37M total funding with NRF and Playground Global (2026); Opened U.S. facility in Tempe, Arizona; Pat Gelsinger (former Intel CEO) joined board
Notable Customers
Intel (partner for advanced packaging development), Samsung (collaboration on semiconductor packaging), TSMC (exploring LEM for chiplet integration)