
Gongda Laser closes several hundred million yuan Series C led by Fortune Capital and Guanghe Chuangtou
Hardware
Originally reported by 猎云网
Shenzhen-based Gongda Laser, a developer of high-power fiber green lasers, has completed a Series C strategic financing round of several hundred million yuan (approximately $40-55M USD). The round was co-led by Fortune Capital (Dachen Caizhi) and Guanghe Chuangtou, with participation from Hechuang Zhiyuan (a Zhongji Innolight affiliate), Huaxu Fund (a SANY Group affiliate), and Lihe Capital. Existing investor Huachuang Capital also followed on. Founded in December 2019, Gongda Laser claims to be the first company globally to achieve a 4kW quasi-single-mode continuous-wave green laser. The company's subsidiary, Xihe Additive Manufacturing (Shenzhen Xihe Zenge Technology), is accelerating commercial deployment of copper-alloy metal 3D printing using green laser LPBF. Over 100 green-laser AM systems are already in use, with a stated three-year plan to deploy 1,000 units, targeting the world's largest copper-based AM production capacity for thermal management components.
This funding represents a significant capital injection into the green-laser AM segment, which addresses a persistent gap in metal additive manufacturing: reliable, high-productivity processing of copper and copper alloys. Copper's high reflectivity at conventional infrared wavelengths (1064nm) has historically limited LPBF throughput and part quality. Green lasers (515nm) offer dramatically higher absorption in copper, enabling denser parts, faster build rates, and larger production volumes. Gongda Laser's vertical integration — from laser source to AM system to application development — mirrors the Chinese localization arc (Pattern P2), where a domestic entrant builds supply-chain control and scales faster than Western competitors. The primary competitive reference is Trumpf's green-laser TruPrint systems, but Gongda's stated 1,000-unit target signals an ambition to outpace any single Western OEM in installed base for copper AM. The application targets — AI compute thermal management (microchannel cold plates), optical transceiver housings, and rocket combustion chambers — align with high-growth demand verticals in consumer electronics, data center infrastructure, and commercial space.
For Gongda Laser, the execution challenge is now purely industrial: converting this capital into reliable, repeatable production throughput at the 1,000-unit scale within three years. The copper AM market is real but nascent — the company must demonstrate that green-laser LPBF can achieve the cost-per-part and yield metrics that copper injection molding or CNC machining currently deliver for high-volume thermal parts. Buyers evaluating Xihe's systems should demand published benchmark data on build rates, density, and surface finish versus Trumpf and conventional copper fabrication. The strategic logic is sound; the proof will be in the production data, not the deployment target.
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