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HP has demonstrated its Multi Jet Fusion technology by printing UAV wing components with wall thicknesses as thin as 0.5mm, thinner than a standard coin.
Technology
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HP has demonstrated its Multi Jet Fusion technology by printing UAV wing components with wall thicknesses as thin as 0.5mm, thinner than a standard coin.

HP Inc.
HP Inc.

Hardware

Originally reported by unmannedsystemstechnology.com

HP has demonstrated its Multi Jet Fusion technology by printing UAV wing components with wall thicknesses as thin as 0.5mm, thinner than a standard coin. This precision on the Jet Fusion 5600 series enables extreme lightweighting, directly increasing flight range and battery efficiency for commercial drones. This advancement transforms AM from a prototyping tool into a primary manufacturing method for aerodynamic surfaces. High-volume thin-wall production is now a viable alternative to expensive carbon fiber. #AdditiveManufacturing #Drones #HP #3DPrinting #Engineering

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How This Connects

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  3. This article

    HP has demonstrated its Multi Jet Fusion technology by printing UAV wing components with wall thicknesses as thin as 0.5mm, thinner than a standard coin.