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3D Glass Solutions

MaterialsAlbuquerque, USAFounded 2005· One of 961 Materials companies tracked by AMPulse

A manufacturer of high-performance 3D glass-based system-in-package (SiP) devices and substrates for high-frequency and high-speed electronic applications.

CEO / Founder
Mark Popovich
Team Size
51-200
Stage
Active
Total Funding
$73.0M
Latest Round
Series C
Key Investors
Intel Capital, Walden Catalyst, Lockheed Martin Ventures, Nagase & Co., Corning, Sun Mountain Capital, Applied Ventures

Technology & Products

Key Products

Complete glass-enabled systems integration services using patented APEX® Glass; foundry services for 3D heterogeneous integration for high-frequency and high-speed electronic applications.

Technological Advantage

Glass offers near-zero electrical loss at high frequencies; the APEX® process allows for the cost-effective, high-volume production of complex 3D structures that are physically impossible to achieve with traditional glass or silicon processing.

Differentiation

Value Proposition

Provides low-loss, high-precision glass substrates that deliver superior electrical performance and thermal stability for 5G, 6G, and high-performance computing compared to traditional silicon or organic materials.

How They Differentiate

Patented APEX® glass-ceramic technology enabling high-precision 3D micro-machining and Through-Glass Vias (TGVs) with near-zero electrical loss at high frequencies (mmWave).

Market & Competition

Target Customers

Semiconductor manufacturers, RF component designers, aerospace and defense contractors, and data center infrastructure providers.

Industry Verticals

["5G/6G Telecommunications","Aerospace & Defense","High-Performance Computing (HPC)","Data Centers","Automotive (LiDAR/Radar)","Medical Devices & Bio-sensors"]

Competitors

Murata Manufacturing Company, Kyocera AVX, Jenoptik

Growth & Milestones

Growth Metrics

Transitioning from R&D to high-volume manufacturing; expanded production capacity in Albuquerque to meet 5G and aerospace demand.

Major Milestones

["Closed $30M Series C funding round led by Walden Catalyst in April 2023","Launched eSIW (Embedded Substrate Integrated Waveguide) PDK in collaboration with Nokia in 2023","Secured $20M Series B1 funding led by Intel Capital in 2021","Established global strategic partnership and distribution agreement with Nagase & Co. in 2019"]

Notable Customers

Nokia, Lockheed Martin, Intel

https://www.3dgsinc.com

Why this company matters

3D Glass Solutions occupies a niche in advanced semiconductor packaging by replacing traditional silicon and organic substrates with glass. Its APEX® glass-ceramic technology enables high-precision 3D micro-machining and through-glass vias (TGVs) using standard semiconductor manufacturing equipment, achieving near-zero electrical loss at millimeter-wave frequencies. This positions the company as an alternative to established substrate suppliers like Murata, Kyocera AVX, and Jenoptik for high-frequency applications.

The core offering is a foundry service for 3D heterogeneous integration, producing glass-based system-in-package (SiP) devices and substrates. The APEX® process allows cost-effective, high-volume fabrication of complex 3D structures that are physically impossible with conventional glass or silicon processing. Key products include the Embedded Substrate Integrated Waveguide (eSIW) process design kit (PDK) launched with Nokia in 2023.

Target customers include semiconductor manufacturers, RF component designers, aerospace and defense contractors, and data center infrastructure providers. Named customers include Nokia, Lockheed Martin, and Intel. Applications span 5G/6G telecommunications, aerospace and defense, high-performance computing, data centers, automotive LiDAR/radar, and medical devices and bio-sensors.

Strategic investors and partners include Intel Capital, Lockheed Martin Ventures, Corning, and Nagase & Co., which also serves as a global distribution and manufacturing partner. The company raised a $30M Series C round led by Walden Catalyst in April 2023, bringing total disclosed funding to $73M. It is transitioning from R&D to high-volume manufacturing, with expanded production capacity in Albuquerque. A key open question is whether glass substrates can achieve the cost parity and manufacturing scale needed to displace incumbent materials in mainstream semiconductor packaging.