Skip to main content

3D Glass Solutions

MaterialsAlbuquerque, USAFounded 2005· One of 884 Materials companies tracked by AMPulse

A manufacturer of high-performance 3D glass-based system-in-package (SiP) devices and substrates for high-frequency and high-speed electronic applications.

CEO / Founder
Babu Mandava
Team Size
50-100
Stage
Active
Total Funding
$73.0M
Latest Round
Series C
Key Investors
Intel Capital, Walden Catalyst, Lockheed Martin Ventures, Nagase & Co., Corning, Sun Mountain Capital, Applied Ventures

Technology & Products

Key Products

["APEX® Glass Substrates","Integrated Passive Devices (IPDs)","3D Glass Interposers","Millimeter-wave (mmWave) Antennas","RF Filters and Couplers","3DHI (Three-Dimensional Heterogeneous Integration) Foundry Services"]

Technological Advantage

Glass offers near-zero electrical loss at high frequencies; the APEX® process allows for the cost-effective, high-volume production of complex 3D structures that are physically impossible to achieve with traditional glass or silicon processing.

Differentiation

Value Proposition

Provides low-loss, high-precision glass substrates that deliver superior electrical performance and thermal stability for 5G, 6G, and high-performance computing compared to traditional silicon or organic materials.

How They Differentiate

Patented APEX® glass-ceramic technology enabling high-precision 3D micro-machining and Through-Glass Vias (TGVs) with near-zero electrical loss at high frequencies (mmWave).

Market & Competition

Target Customers

Semiconductor manufacturers, RF component designers, aerospace and defense contractors, and data center infrastructure providers.

Industry Verticals

["5G/6G Telecommunications","Aerospace & Defense","High-Performance Computing (HPC)","Data Centers","Automotive (LiDAR/Radar)","Medical Devices & Bio-sensors"]

Competitors

["Qorvo","Akoustis Technologies","Murata Manufacturing"]

Growth & Milestones

Growth Metrics

Transitioning from R&D to high-volume manufacturing; expanded production capacity in Albuquerque to meet 5G and aerospace demand.

Major Milestones

["Closed $30M Series C funding round led by Walden Catalyst in April 2023","Launched eSIW (Embedded Substrate Integrated Waveguide) PDK in collaboration with Nokia in 2023","Secured $20M Series B1 funding led by Intel Capital in 2021","Established global strategic partnership and distribution agreement with Nagase & Co. in 2019"]

Notable Customers

["Nokia","Lockheed Martin","Intel"]