Bocheng Technology
Dongguan Bocheng Plastic Technology Co., Ltd. is a Chinese national high-tech enterprise specializing in the R&D, production and sales of multi-layer co-extruded barrier packaging materials and automated intelligent packaging equipment, primarily serving the PCB industry since 2006.
- CEO / Founder
- Li Honghe (李洪河)
- Team Size
- 201-500
- Stage
- Active
- Latest Round
- Bootstrapped
Technology & Products
Key Products
Multi-layer co-extruded vacuum bags; vacuum textured bags/rolls; aluminum foil bags; high/low temperature retort films; PE films; anti-static multi-layer co-extruded films; high-temperature resistant asymmetric multi-layer co-extruded films; ink liquid packaging multi-layer co-extruded films; 5th generation intelligent automatic packaging line (auto board splitter, auto shrink wrapper, auto vacuum packager, auto case erector, auto case sealer).
Technological Advantage
Seven-layer co-extrusion water-cooled downward-blown film technology (rare in Pearl River Delta); self-developed MES system for full traceability; 5th generation intelligent automatic packaging line that replaces manual packaging labor; monthly film production capacity of 400 tons; 12,000 sqm factory.
Differentiation
Value Proposition
Specialized provider of multi-layer co-extruded high-barrier packaging films and automated intelligent packaging lines for the PCB industry, offering cost-effective, environmentally friendly alternatives to traditional composite packaging with fast customization and delivery.
How They Differentiate
End-to-end solution from packaging materials (multi-layer co-extruded films) to automated intelligent packaging equipment (5th generation), with proprietary material formulations (30+ R&D projects), patented technology (11 invention patents, 30+ utility model patents), and deep vertical specialization in PCB industry packaging for 17+ years.
Market & Competition
Target Customers
PCB manufacturers (PCB fabrication plants), electronics component manufacturers, food packaging companies, pharmaceutical packaging companies, precision hardware manufacturers
Industry Verticals
PCB/Electronics; Food; Pharmaceutical; Medical; Daily Chemical; Precision Hardware
Competitors
Shenzhen Yitoa Intelligent Packaging Co., Ltd.; Dongguan Jinyi Packaging Materials Co., Ltd.; Other multi-layer co-extruded film manufacturers serving the PCB and electronics packaging industry
Growth & Milestones
Growth Metrics
2022 revenue: RMB 200 million (~$28M); Monthly film production capacity: 400 tons; Factory area: 12,000 sqm; Over 30 intelligent packaging lines sold by 2022
Major Milestones
2006: Company founded (as Dongguan Bocheng Electronic Plastic Co., Ltd.); 2008: Revenue grew counter-cyclically, established equipment manufacturing subsidiary; 2012: New factory in Gaobu town, introduced 5-layer co-extrusion equipment; 2015: Developed vacuum fresh food textured bags; 2017: Developed fully automatic vacuum packaging line, first line deployed at listed PCB company; 2017/2020: Added two 7-layer co-extrusion production lines, factory expanded to 12,000 sqm; 2022: Launched 5th generation intelligent automatic packaging equipment; 2022: Revenue reached RMB 200 million (~$28M); 2023: Recognized as National High-Tech Enterprise, Guangdong Provincial Specialized and New (专精特新) SME
Notable Customers
Shengyi Electronics (胜宏); Zhihao Technology (志浩); Jingpeng (敬鹏); Ximenkai (希门凯); Various listed PCB companies in China