EoPlex
Develops HVAM (High Volume Additive Manufacturing) technology and CSI Manufacturing Platform for multi-material 3D-printed semiconductor packaging and miniature devices, enabling cost, size, and performance efficiencies.
- CEO / Founder
- Dato Loh Soon Gnee "Michael"
- Team Size
- 11-50
- Stage
- Established
- Total Funding
- $24.4M
- Latest Round
- Series D - $3.8M - November 2009
- Key Investors
- ATA Ventures; Draper Fisher Jurvetson; Labrador Ventures; Draper Richards
Technology & Products
Key Products
HVAM (High Volume Additive Manufacturing) technology; CSI Manufacturing Platform; xLC™ product for leadframe market; multi-material 3D-printed semiconductor packaging and miniature devices.
Technological Advantage
Patented HVAM process achieves high-volume 3D printing with multi-material capability, protected by intellectual property; manufacturing scale with access to 2,300 employees, 14 factories, and 4 R&D centers globally provides operational moat.
Differentiation
Value Proposition
Reduces semiconductor packaging production cost and size while enhancing thermal/electrical performance through proprietary multi-material 3D printing, cutting lead times and enabling complex geometries impossible with conventional methods.
How They Differentiate
EoPlex differentiates through its HVAM technology, offering 3x higher volume capability for multi-material parts than traditional binder jetting. Its proprietary CSI platform enables semiconductor packaging at 40% lower cost and 50% size reduction compared to conventional lead frames, distinguishing it from competitors focused on single-material or lower-volume additive manufacturing.
Market & Competition
Target Customers
Semiconductor packaging manufacturers, advanced component producers in energy, sensors, and microdevices
Industry Verticals
Semiconductor; Electronics; Energy; Sensors; Medical Devices
Competitors
Cytonix, Grid Logic, STG-BEIKIRCH, Adaptica, Nano Dimension, Molex, Optomec.
Growth & Milestones
Growth Metrics
EoPlex has access to 2,300 employees, 14 factories, and 4 R&D centers located across China, Southeast Asia, United Kingdom, and the United States.
Major Milestones
Founded (2001); HVAM technology development (2012); Partnership with MCT (2015); ANST qualification of CSI Platform; Global expansion with 14 factories and 4 R&D centers
Notable Customers
MCT (Malaysian Circuit Technology) - a partner in semiconductor assembly and test.