Skip to main content

LPKF Laser & Electronics

HardwareGarbsen, GermanyFounded 1976· One of 1702 Hardware companies tracked by AMPulse

Develops high-precision laser systems for PCB prototyping, microelectronics, and glass structuring, replacing mechanical processes with high-speed laser material processing.

CEO / Founder
Dr. Klaus Fiedler
Team Size
501-1000
Stage
Public
Total Funding
Publicly Traded
Latest Round
IPO
Key Investors
Eiffel Investment Group; BMBF; European Union

Technology & Products

Key Products

High-volume laser processing solutions for advanced semiconductor packaging, industrial manufacturing, and rapid PCB prototyping. Specializes in precision laser processing, laser material processing, microsystems technology, and control technology & software.

Technological Advantage

Proprietary LIDE technology for semiconductor-grade glass structuring and Fusion3D for Laser Direct Structuring (LDS) of 3D circuit carriers; 40+ years of laser processing IP.

Differentiation

Value Proposition

Enables rapid prototyping and mass production of complex electronics and micro-components with micron-level precision, reducing lead times and enabling 3D circuit carrier production.

How They Differentiate

Offers specialized UV laser rubout and scan field stitching technologies that provide higher precision and larger build areas than standard mechanical or basic laser systems.

Market & Competition

Target Customers

PCB manufacturers, electronics/automotive suppliers, solar and semiconductor manufacturers, and research institutions.

Industry Verticals

Electronics; Automotive; Solar; Semiconductors; Medical Technology; Biotechnology; Research & Education

Competitors

Senin Technologies, Laser Photonics, 4JET, Scansonic, ACI, Jameco Electronics, Segue Electronics

Growth & Milestones

Growth Metrics

773 employees; 25-year history for ProtoLaser line; Vitrion Foundry opened in 2023.

Major Milestones

1976: Founded and filed first PCB patent; 1998: IPO on German stock exchange; 2000: Launch of ProtoLaser family; 2009: Fusion3D breakthrough for mass production; 2010: Received Hermes Award for innovation; 2023: Opened Vitrion Foundry for glass microcomponents

Notable Customers

StenTech; BOE