LPKF Laser & Electronics
Develops high-precision laser systems for PCB prototyping, microelectronics, and glass structuring, replacing mechanical processes with high-speed laser material processing.
- CEO / Founder
- Klaus Fiedler
- Team Size
- 501-1000
- Stage
- Public
- Total Funding
- $315K
- Latest Round
- IPO
- Key Investors
- Eiffel Investment Group; BMBF; European Union
Technology & Products
Key Products
ProtoLaser S; ProtoLaser U3; ProtoLaser ST; LIDE; MicroLine; Fusion3D; StencilLaser
Technological Advantage
Proprietary LIDE technology for semiconductor-grade glass structuring and Fusion3D for Laser Direct Structuring (LDS) of 3D circuit carriers; 40+ years of laser processing IP.
Differentiation
Value Proposition
Enables rapid prototyping and mass production of complex electronics and micro-components with micron-level precision, reducing lead times and enabling 3D circuit carrier production.
How They Differentiate
Offers specialized UV laser rubout and scan field stitching technologies that provide higher precision and larger build areas than standard mechanical or basic laser systems.
Market & Competition
Target Customers
PCB manufacturers, electronics/automotive suppliers, solar and semiconductor manufacturers, and research institutions.
Industry Verticals
Electronics; Automotive; Solar; Semiconductors; Medical Technology; Biotechnology; Research & Education
Competitors
MITS Electronics; Orbotech; 3D-Micromac
Growth & Milestones
Growth Metrics
773 employees; 25-year history for ProtoLaser line; Vitrion Foundry opened in 2023.
Major Milestones
1976: Founded and filed first PCB patent; 1998: IPO on German stock exchange; 2000: Launch of ProtoLaser family; 2009: Fusion3D breakthrough for mass production; 2010: Received Hermes Award for innovation; 2023: Opened Vitrion Foundry for glass microcomponents
Notable Customers
StenTech; BOE