HardwareZhongshan, Guangdong, ChinaFounded 2022· One of 1739 Hardware companies tracked by AMPulse
Develops proprietary electrochemical 3D printing (ECP) technology to manufacture high-performance Vapor Chamber (VC) lids with integrated micro-wick structures for AI chip thermal management.
CEO / Founder
Zhou Wei
Team Size
51-200
Stage
Active
Total Funding
$15M
Latest Round
Series A
Key Investors
Wanzhong Holding; Zhongshan Venture Capital
Technology & Products
Key Products
High-performance Vapor Chamber (VC) lids with integrated micro-wick structures for AI chip thermal management, manufactured using proprietary electrochemical 3D printing (ECP) technology.
Technological Advantage
Claimed: 30% improvement in heat dissipation efficiency; Verified: Patents for electrochemical 3D printing of micro-column arrays (CN115837844A); Defensible: Proprietary electrolyte formulations and process control software.
Differentiation
Value Proposition
Reduces thermal resistance in AI chip packaging by 20-30% compared to traditional sintered wicks, enabling higher power densities and improved cooling efficiency for data centers.
How They Differentiate
Unlike Fabric8Labs' general metal AM focus, Zhongde specializes in semiconductor thermal management, achieving 20% lower thermal resistance than industry-standard sintered copper wicks used by incumbents like Delta.
Market & Competition
Target Customers
Semiconductor packaging companies and AI server OEMs requiring advanced thermal management solutions for high-power chips.
Industry Verticals
AI; Data Centers; Semiconductor; Telecommunications
Competitors
Fabric8Labs; Delta Electronics; Auras Technology
Growth & Milestones
Growth Metrics
Secured nearly $7M in early-stage funding; Established a dedicated manufacturing facility in Zhongshan to scale VC lid production.
Major Milestones
2022: Company founded; 2023: Seed funding round completed; 2024: Established mass production facility in Zhongshan
Zhongde Technology occupies a narrow but high-value niche: electrochemical 3D printing (ECP) of vapor chamber lids for AI chip thermal management. While most metal AM companies target general-purpose part production, Zhongde focuses exclusively on semiconductor packaging, where heat dissipation is a bottleneck for higher power densities in data centers.
The core process is a proprietary room-temperature electrochemical deposition that builds high-surface-area micro-structures directly onto substrates. This bypasses the thermal stress and geometric constraints of traditional sintered copper wicks, enabling integrated micro-wick structures within vapor chamber lids. The company claims a 20-30% reduction in thermal resistance compared to conventional sintered wicks, with patents covering micro-column array preparation (CN115837845A) and vapor chamber fabrication methods.
Target customers are semiconductor packaging firms and AI server OEMs that need advanced cooling for high-power chips. Zhongde competes against incumbents like Delta Electronics and Auras Technology, which rely on sintered wick processes, and against general metal AM players such as Fabric8Labs. Its differentiation lies in specialization: achieving lower thermal resistance than industry-standard sintered copper wicks by tailoring the electrochemical process to thermal management geometries.
Founded in 2022 and based in Zhongshan, Guangdong, the company has raised approximately $15 million from Wanzhong Holding and Zhongshan Venture Capital. It established a dedicated manufacturing facility in 2024 to scale VC lid production. A research partnership with Sun Yat-sen University supports continued process development. The key open question is whether the ECP process can achieve the throughput and cost structure required for volume adoption by major semiconductor packaging houses.
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