Zhongde Technology
Develops proprietary electrochemical 3D printing (ECP) technology to manufacture high-performance Vapor Chamber (VC) lids with integrated micro-wick structures for AI chip thermal management.
- CEO / Founder
- Zhou Wei
- Team Size
- 51-200
- Stage
- Active
- Total Funding
- $15M
- Latest Round
- Series A
- Key Investors
- Wanzhong Holding; Zhongshan Venture Capital
Technology & Products
Key Products
High-performance Vapor Chamber (VC) lids with integrated micro-wick structures for AI chip thermal management, manufactured using proprietary electrochemical 3D printing (ECP) technology.
Technological Advantage
Claimed: 30% improvement in heat dissipation efficiency; Verified: Patents for electrochemical 3D printing of micro-column arrays (CN115837844A); Defensible: Proprietary electrolyte formulations and process control software.
Differentiation
Value Proposition
Reduces thermal resistance in AI chip packaging by 20-30% compared to traditional sintered wicks, enabling higher power densities and improved cooling efficiency for data centers.
How They Differentiate
Unlike Fabric8Labs' general metal AM focus, Zhongde specializes in semiconductor thermal management, achieving 20% lower thermal resistance than industry-standard sintered copper wicks used by incumbents like Delta.
Market & Competition
Target Customers
Semiconductor packaging companies and AI server OEMs requiring advanced thermal management solutions for high-power chips.
Industry Verticals
AI; Data Centers; Semiconductor; Telecommunications
Competitors
Fabric8Labs; Delta Electronics; Auras Technology
Growth & Milestones
Growth Metrics
Secured nearly $7M in early-stage funding; Established a dedicated manufacturing facility in Zhongshan to scale VC lid production.
Major Milestones
2022: Company founded; 2023: Seed funding round completed; 2024: Established mass production facility in Zhongshan