Zhongde Technology
HardwareZhongshan, Guangdong, ChinaFounded 2019
Develops and manufactures Vapor Chamber (VC) Lids for high-power chip packaging using proprietary electrochemical 3D printing technology to enhance thermal management for AI applications.
- Stage
- Seed
- Latest Round
- Seed
- Key Investors
- Wanzhong Holding
Technology & Products
Key Products
VC Lids (Vapor Chamber Lids) for chip packaging
Market & Competition
Target Customers
Semiconductor packaging companies and AI chip manufacturers
Industry Verticals
Semiconductors; Electronics; Data Centers