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Zhongde Technology secured tens of millions of yuan in Series A funding to scale electrochemical 3D printing for AI chip thermal management.
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Zhongde Technology secured tens of millions of yuan in Series A funding to scale electrochemical 3D printing for AI chip thermal management.

Zhongde Technology

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Originally reported by 南极熊

Zhongde Technology secured tens of millions of yuan in Series A funding to scale electrochemical 3D printing for AI chip thermal management. Their atomic stacking process slashes production time from 5 days to under 90 minutes while doubling structural strength to 600kg. As AI GPUs reach 1400W, this technology delivers a 20% thermal conductivity boost over traditional sintering. This represents a systemic shift toward integrating 3D printed micro-thermal architectures directly into semiconduc...

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    Zhongde Technology secured tens of millions of yuan in Series A funding to scale electrochemical 3D printing for AI chip thermal management.