3DGS Semicon opens advanced 3D semiconductor packaging facility in Odisha, India

3DGS Semicon has officially inaugurated a new advanced semiconductor packaging facility located in Odisha, India. The facility utilizes specialized expertise from US-based 3D Glass Solutions to provide high-end packaging services. This site is designed to facilitate heterogeneous integration, a process that combines multiple specialized chiplets into a single package to overcome traditional silicon scaling limits. The project aligns with the India Semiconductor Mission (ISM) and the national Make in India initiative to build a domestic semiconductor ecosystem.

Advanced packaging is a critical bottleneck in the global semiconductor supply chain, particularly for AI, 5G, and automotive applications. As traditional Moore's Law scaling becomes increasingly expensive, the industry is shifting toward chiplet-based architectures and heterogeneous integration to maintain performance gains. The global chiplet market is projected to reach $411 billion by 2035. By establishing this facility, 3DGS Semicon moves India up the value chain from its historical focus on chip design toward high-value manufacturing, competing with established players like ASE Technology Holding, Amkor Technology, and TSMC who dominate technologies such as CoWoS and Foveros.

To succeed, 3DGS Semicon must navigate significant local infrastructure hurdles, including the need for ultra-pure water, uninterrupted power, and specialized chemical logistics. The company will also need to address a projected domestic talent gap of up to 300,000 skilled professionals by 2027. Operational success depends on the ability to integrate this new packaging capacity into a reliable supply chain that currently relies on imports for 80-90% of semiconductor needs.