APES demonstrates Matrix6D additive manufacturing platform live at RAPID + TCT 2026

Advanced Printed Electronics Solutions (APES) provided a live demonstration of its Matrix6D platform during the RAPID + TCT 2026 conference. Led by CEO and founder Dr. Rich Neill, the company showcased the platform's capability to execute advanced additive manufacturing processes specifically tailored for the semiconductor sector. This demonstration follows the company's established partnership with Great Lakes Semiconductor, where the Matrix6D serves as a core component of a Fab-as-a-Service (FaaS) production model.

The Matrix6D platform addresses the critical industry requirement for high-mix, low-volume semiconductor packaging, moving beyond traditional 2D layouts into 2.5D and 3D architectures. As the semiconductor industry shifts toward chiplet-based System-in-a-Package (SiP) designs, the demand for additive tools capable of precise z-axis integration is increasing. APES occupies a specialized niche in the semiconductor capital equipment (semicap) value chain, providing the hardware necessary to bridge the gap between wafer fabrication and advanced component packaging. This positioning allows for more agile, on-demand production cycles compared to traditional, fixed-capital semiconductor manufacturing facilities.

For manufacturers, the practical utility of the Matrix6D lies in its ability to facilitate the transition to Foundry 2.0 models, where advanced packaging is integrated directly into the service offering. Success for APES will depend on the seamless integration of this hardware into existing semiconductor workflows and the ability to maintain high yields during complex chiplet stacking. Users looking to implement Fab-as-a-Service models should evaluate the platform's compatibility with specific high-density interconnect requirements and material compatibility for advanced electronic substrates.