ATLANT 3D, A*STAR IMRE and NAMIC sign MoU to launch A-HUB materials foundry in Singapore

ATLANT 3D, the Danish atomic-layer additive manufacturing company, has signed a Memorandum of Understanding with Singapore's A*STAR Institute of Materials Research and Engineering (IMRE) and the National Additive Manufacturing Innovation Cluster (NAMIC) to establish the Advanced Materials Development Hub (A-HUB) in Singapore. The partnership will combine ATLANT 3D's proprietary Direct Atomic Layer Processing (DALP) technology with A*STAR IMRE's materials science capabilities and NAMIC's additive manufacturing ecosystem to pursue AI-driven materials discovery for advanced packaging, silicon photonics, and semiconductor manufacturing. The hub aims to enable high-throughput materials synthesis and autonomous discovery, with the stated goal of creating a first-of-its-kind materials innovation foundry for semiconductor applications.

This collaboration sits at the intersection of two structural trends in advanced manufacturing: the push to integrate AI-driven closed-loop experimentation into materials development, and the strategic buildout of sovereign advanced manufacturing infrastructure in Asia-Pacific. ATLANT 3D's DALP technology, which enables atomic-scale deposition and etching without vacuum chambers, is positioned as a hardware platform for high-throughput materials screening - a role that differs from conventional AM production. The partnership leverages Singapore's existing strength in semiconductor packaging and photonics, and NAMIC's role as a national platform for AM ecosystem development. The move aligns with the broader industry shift toward materials informatics and autonomous labs, where AM tools serve as synthesis engines rather than end-part producers.

For ATLANT 3D, this MoU provides a pathway to embed its technology in a government-backed materials innovation cluster, potentially accelerating qualification cycles for semiconductor and photonics applications. The practical test will be whether A-HUB can move from MoU to operational foundry with measurable throughput improvements in materials discovery, and whether the DALP platform can integrate with existing semiconductor workflows. For the AM industry, this represents a continued expansion of atomic-layer processes beyond research labs into structured innovation programs with clear industrial end-markets.