
EOS qualifies Constellium Aheadd CP1 aluminum alloy for LPBF, rebrands it EOS Aluminium Constellium CP1
Hardware
Originally reported by 3DPrint.com
EOS is qualifying Constellium's Aheadd CP1 aluminum alloy for its LPBF platforms, rebranding it EOS Aluminium Constellium CP1, while retaining Constellium's existing Al5X1 material as EOS Aluminium Constellium Al5X1. The two companies developed validated process parameters together, and EOS's Additive Minds team will support customers scaling production in both powders. Target applications include semiconductor heat sinks and wafer carriers, lightweight structural parts, corrosion-resistant components, and heat exchangers.
CP1 contains no magnesium or zinc, which EOS says enables stable processing at high laser power along with improved elongation, strength, and thermal stability compared with the industry-standard AlSi10Mg, plus easier anodizing and electrochemical polishing without a post-print quench. Those properties cut process steps and lower part-failure risk, positioning CP1 as a candidate to requalify existing AlSi10Mg production rather than serve only new designs. Al5X1, by contrast, targets aerospace, transportation, and motorsport use, reaching roughly 400 MPa tensile strength with over 13 percent elongation after a one-step, non-quenching heat treatment. Constellium, an $8 billion revenue aluminum producer, has already tested CP1 with STELIA on fuselage structures and supported an America Makes dataset for the alloy.
The move formalizes EOS's shift beyond generic AlSi10Mg toward alloys engineered specifically for LPBF thermal behavior and post-processing economics, a pattern also emerging around proprietary aluminum powders from suppliers like Equispheres.
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