GLS and APES have launched a strategic partnership to integrate semiconductor manufacturing with Add...

GLS and APES have launched a strategic partnership to integrate semiconductor manufacturing with Additively Manufactured Electronics (AME). This collaboration utilizes pocket fabs to embed active chips into 3D structures, reducing electronic footprints by up to 50 percent. By merging semiconductor precision with AI-driven swarm factories, the duo is bypassing traditional 2D PCB constraints for high-density interconnects. This systemic shift enables localized, resilient production for high-stakes aerospace and automotive applications. It marks a critical move toward fully integrated 3D microelectronics. 🚀 #AME #3DPrinting #Semiconductors #Innovation #TechTrend