Xi’an Guohong Tianyi has launched a 3D printing solution for high-conductivity Silicon Carbide to ad...

Xi’an Guohong Tianyi has launched a 3D printing solution for high-conductivity Silicon Carbide to address AI GPU thermal bottlenecks. The process achieves thermal conductivity over 150 W/m K and 0.05 mm precision for complex cooling geometries. It enables Gyroid microchannels with 10:1 depth ratios, surpassing traditional machining limits. This shift to ceramic additive manufacturing is essential for next-gen high-density electronics. 🚀 #AM #3DPrinting #AI #ThermalManagement #SiliconCarbide