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Junjing Technology has debuted large-scale Silicon Carbide (SiC) heat sinks and a multi-material DLP ceramic system at TCT, targeting the cooling needs of 1000W+ AI power modules.
Technology
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Junjing Technology has debuted large-scale Silicon Carbide (SiC) heat sinks and a multi-material DLP ceramic system at TCT, targeting the cooling needs of 1000W+ AI power modules.

Originally reported by 南极熊

Junjing Technology has debuted large-scale Silicon Carbide (SiC) heat sinks and a multi-material DLP ceramic system at TCT, targeting the cooling needs of 1000W+ AI power modules. By overcoming SiC’s UV absorption challenges, the startup enables 3D printed lattice structures that can reduce operating temperatures by up to 20°C versus traditional methods. Their multi-material capability allows for functionally graded components, integrating insulation and high thermal conductivity in one build. This signals a shift from ceramic prototyping to mission-critical semiconductor and aerospace infrastructure at scale.

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    Junjing Technology has debuted large-scale Silicon Carbide (SiC) heat sinks and a multi-material DLP ceramic system at TCT, targeting the cooling needs of 1000W+ AI power modules.