Sengong Technology to show ComproJet binder jetting and AutoBio DIW printers at Ningbo copper forum, Formnext Asia Shenzhen

Shenzhen-based Sengong Technology, founded in 2012, will show its research-grade 3D printers at two trade shows this month: the Ningbo 2026 Copper Composite Developer Forum (August 24-26, booth C20) and Formnext Asia Shenzhen (August 26-28, Shenzhen World Exhibition and Convention Center, booth F05-F06). At Ningbo it exhibits the ComproJet binder jetting printer, built on a Ricoh G5 piezo printhead at 600 DPI with 0.1-0.2mm accuracy and three swappable build chambers from 30x30x30mm to 150x90x80mm. In Shenzhen it adds the AutoBio direct ink writing line, which prints hydrogel, gelatin, hydroxyapatite, and cell-suspension materials at a 0.1mm minimum nozzle diameter.

The swappable micro-chambers target a real cost problem: testing high-value powders like diamond-copper composites on industrial binder jetting systems usually means filling a full build volume regardless of sample size. Sengong's academic client list, including Tsinghua, Peking University, and the Chinese Academy of Sciences, points to a research-tool AM segment building out alongside China's industrial-scale manufacturers. For labs piloting copper-composite or bioprinting workflows, the smaller chambers cut the material cost of early-stage iteration before scaling up.