华工激光 unveils full-stack intelligent manufacturing solutions for AI computing at laser open day

华工激光, a subsidiary of Huagong Tech, unveiled a comprehensive suite of intelligent manufacturing solutions for AI computing hardware at its Laser Open Day on July 3, 2026. The company's announcement covers six domains: semiconductors, advanced packaging, optical modules, high-speed connectors, chip-level liquid cooling, and additive manufacturing. Key hardware includes a green laser SLM metal 3D printing system for pure copper and highly reflective materials, and an infrared SLM system for large-scale aluminum and titanium alloy heat sinks. The company also demonstrated a glass substrate micro-hole processing system achieving 5μm minimum aperture with a 1:100 aspect ratio and 99.9% through-hole rate, alongside automated assembly and inspection equipment for 1.6T optical modules and high-speed connectors.

This launch positions 华工激光 as a vertically integrated supplier targeting the AI infrastructure buildout, a market that demands precision manufacturing across multiple material and process families. The company's strategy mirrors the Chinese localization arc pattern, where a domestic entrant builds a full-stack capability-from lasers and optics to automation and inspection-to serve a rapidly growing domestic AI hardware ecosystem. The copper AM systems are particularly notable, as pure copper's high reflectivity has historically limited LPBF adoption for thermal management components. By offering both green and infrared SLM routes, 华工激光 addresses a known production bottleneck in liquid cooling, where complex microchannel geometries are increasingly required for high-power AI server racks. The breadth of the offering-spanning wafer processing, advanced packaging, optical assembly, and thermal management-suggests the company is aiming to become a one-stop shop for Chinese AI hardware manufacturers, competing with both domestic laser specialists and international equipment suppliers.

From an industry perspective, the practical significance lies in 华工激光's ability to deliver integrated, production-ready systems rather than isolated machine tools. The company must now demonstrate that its copper AM systems can achieve the repeatability and throughput required for volume production of liquid cooling components, and that its advanced packaging equipment can meet the yield standards of major OSATs and foundries. For buyers in the AI supply chain, the availability of a domestic full-stack supplier could reduce lead times and qualification complexity, but the real test will be field performance data and customer references. The announcement is a credible signal of capability breadth, but execution discipline across six parallel product lines will determine whether this becomes a meaningful competitive force or a broad but shallow portfolio.