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Xi’an Guohong Tianyi has launched a 3D printing solution for high-conductivity Silicon Carbide to address AI GPU thermal bottlenecks.
Technology
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Xi’an Guohong Tianyi has launched a 3D printing solution for high-conductivity Silicon Carbide to address AI GPU thermal bottlenecks.

Guohong Tianyi
Guohong Tianyi

Hardware

Originally reported by Panda3DP

Xi’an Guohong Tianyi has launched a 3D printing solution for high-conductivity Silicon Carbide to address AI GPU thermal bottlenecks. The process achieves thermal conductivity over 150 W/m K and 0.05 mm precision for complex cooling geometries. It enables Gyroid microchannels with 10:1 depth ratios, surpassing traditional machining limits. This shift to ceramic additive manufacturing is essential for next-gen high-density electronics. 🚀

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