3DGS Semicon
Provides advanced semiconductor packaging services for heterogeneous integration of chiplets, utilizing specialized glass-based packaging technologies to overcome traditional silicon scaling limits.
- CEO / Founder
- Babu Mandava
- Team Size
- 51-200
- Stage
- Growth Stage
- Total Funding
- $30M
- Latest Round
- Series C
- Key Investors
- Walden Catalyst Ventures; Intel Capital; Lockheed Martin Ventures; Applied Ventures, LLC; Cambium Capital; Mesh Cooperative Ventures; Corning Incorporated; Sun Mountain Capital; Menlo Microsystems Inc.; CerraCap Ventures
Technology & Products
Key Products
Advanced semiconductor packaging services; Heterogeneous integration solutions
Technological Advantage
Proprietary glass-based packaging technologies for high-frequency applications, enabling heterogeneous integration critical for AI, 5G, and automotive chips. The advantage is protectable via trade secrets and specialized expertise from its US parent, though replicable by well-funded competitors with similar R&D capabilities.
Differentiation
Value Proposition
Enables chiplet-based architectures and heterogeneous integration to maintain performance gains as Moore's Law scaling becomes expensive, moving India up the semiconductor value chain from design to high-value manufacturing.
How They Differentiate
Focuses on glass-based packaging for high-frequency applications and heterogeneous integration, positioning as a domestic Indian alternative to established global players like TSMC (CoWoS, Foveros) and ASE, with potential cost and supply chain advantages within India.
Market & Competition
Target Customers
Semiconductor companies requiring high-end packaging for AI, 5G, and automotive applications.
Industry Verticals
Semiconductor; AI; 5G; Automotive
Competitors
ASE Technology Holding; Amkor Technology; TSMC
Growth & Milestones
Growth Metrics
Inauguration of advanced packaging facility in Odisha; facility opening boosting investor confidence in India's semiconductor goals; reports mention strong revenue growth and profit (though official filings not specified)
Major Milestones
Inauguration of advanced semiconductor packaging facility in Odisha, India in 2025