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Bond3D

HardwareEnschede, NetherlandsFounded 2014· One of 1199 Hardware companies tracked by AMPulse

Bond3D develops 3D printing technology for high-performance polymers (PEEK) with isotropic strength and 100% voidless parts.

CEO / Founder
Gerald Holtvluwer
Team Size
70
Stage
Subsidiary
Total Funding
Undisclosed
Latest Round
Acquired
Key Investors
Victrex, Holland in the Valley, Demcon (acquirer)

Technology & Products

Key Products

Bond3D PEEK 3D Printers, PEEK printing services, Application development

Technological Advantage

Patented process preserves PEEK properties in 3D printed parts; enables leak-tight fluid and gas manifolds

Differentiation

Value Proposition

Creates functional 3D printed parts from PEEK with material properties matching injection molding quality.

How They Differentiate

Unique technology producing voidless PEEK parts suitable for critical fluid handling applications

Market & Competition

Target Customers

Medical device manufacturers, aerospace OEMs, energy companies, automotive manufacturers

Industry Verticals

Medical, Aerospace, Energy, Automotive, Semiconductor

Competitors

Stratasys (FDM), 3D Systems (SLS), Apium

Growth & Milestones

Growth Metrics

51-200 employees as of 2024; Acquired by Demcon Group December 2024; Serving multiple industrial verticals

Major Milestones

2014: Founded in Enschede, Netherlands; 2019: Series A funding from Victrex; First 100% leak-proof 3D printed products; Expanded into medical implants market; 2024-12: Acquired by Demcon Group

Notable Customers

Medical implant manufacturers, Semiconductor industry companies, Renewable energy companies, Aerospace firms