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Raise3D

HardwareIrvine, USA; Rotterdam, Netherlands; Shanghai, ChinaFounded 2015· One of 1636 Hardware companies tracked by AMPulse

Raise3D manufactures and supplies professional-grade FDM and DLP 3D printers, software, and materials for flexible manufacturing and rapid prototyping.

CEO / Founder
Edward Feng
Team Size
201-500
Stage
Active
Total Funding
$15.8M
Latest Round
Series C
Key Investors
Byte Capital; Shanghai STVC Group; Blue Lake Capital; Grand Yangtze Capital; 顺融资本; 长江国弘

Technology & Products

Key Products

Pro3 HS Series, DF2 Series (DLP), Pro3 Series, E2CF, RMF500, ideaMaker (slicing software), RaiseCloud (print management), Open Filament Program (OFP) compatible filaments

Technical position · AMPulse analysis

Focus on 'Flexible Manufacturing' solutions that allow businesses to quickly shift from prototyping to small-batch production on the same platform, reducing costs and lead times. Their printers are known for reliability and high-uptime.

Differentiation

Value Proposition

Providing a complete, reliable, and industrial-grade 3D printing ecosystem (printers, software, materials) that enables flexible manufacturing, rapid prototyping, and small-batch production with high accuracy and a large build volume.

How They Differentiate

Raise3D competes by offering larger build volumes and a focus on industrial-grade reliability at a competitive price point. Its open ecosystem and dual-extrusion capabilities are key differentiators from competitors like Formlabs (SLA/SLS focused) and it offers a more robust solution compared to prosumer brands.

Market & Competition

Target Customers

Professionals and businesses in manufacturing, engineering, automotive, aerospace, medical, and education sectors.

Industry Verticals

Manufacturing, Automotive, Aerospace, Medical, Consumer Goods, Education

Competitors

UltiMaker; Formlabs; BCN3D

Growth & Milestones

Growth Metrics

Information not publicly available, but the company has expanded its global presence and product line, including diversification into DLP technology (DF2 series).

Major Milestones

2015: Founded, 2016: Launched N2 series via Kickstarter, 2018: Established global offices in the US and Europe, 2022: Secured Series C funding, 2023: Launched DF2 DLP printer series, 2024: Launched Pro3 HS Series for high-speed printing

Notable Customers

TE Connectivity; Biffi Luce; Purdue University

https://www.raise3d.com

Recent coverage of Raise3D

AM patents

AM-relevant patents linked to this company.

Patents
6
Granted
2
Families
6

Leading domains: process (6), equipment (5), material (1)

Filings by year: 2024: 1 · 2018: 1 · 2017: 3 · 2015: 1

  1. MATERIAL BREAKAGE DETECTION APPARATUS FOR PRINTER FILAMENT AND METHOD2026007259 · WO
  2. Double-spray head positioning and switching device for 3D printer108312526 · CN
  3. Discharged material heat-preservation method and device used for 3D printer107696495 · CN
  4. Movement device of 3D printer105346082 · CN
  5. Double-sprayer switching device for 3D printer107599393 · CN

Funding rounds

  • Series C$15.8M2022-02-18Lead: GP Capital
  • Series BTerms undisclosed2021-05-24Lead: Blue Lake Capital
  • Series B数千万元 RMB2019-10-09Lead: 长江国弘 · Source: nanjixiong
  • Series AUndisclosed2018-07-31Lead: 顺融资本 · Source: nanjixiong
  • SeedTerms undisclosed2014-01-01

Equipment deals on record

Publicly disclosed purchases or installs only.

  • RMS220

    1 systems · CNY 170,000

    Buyer: Shanghai University · Supplier: Shanghai Zhitong Intelligent Technology
All equipment activity

Why this company matters

AMPulse analysis, not a company disclosure

Raise3D positions itself as a provider of professional-grade FDM and DLP 3D printing systems for flexible manufacturing and rapid prototyping. Founded in 2015, the company has built a global footprint with offices in Irvine, Rotterdam, and Shanghai, and has raised $15.8M from investors including Byte Capital and Shanghai STVC Group.

The company's core offering centers on large-format FFF printers such as the Pro3 HS Series and E2CF, alongside the DF2 Series for DLP. Its proprietary software stack includes ideaMaker for slicing and RaiseCloud for print management. The Open Filament Program (OFP) ensures compatibility with a wide range of third-party materials, including partnerships with BASF Forward AM, Henkel Loctite, and Würth Additive Group.

Target customers span manufacturing, automotive, aerospace, medical, consumer goods, and education. Named users include TE Connectivity, Biffi Luce, and Purdue University. Raise3D differentiates from competitors like UltiMaker and Formlabs by offering larger build volumes and dual-extrusion capabilities at a competitive price point, with a focus on reliability and high uptime for small-batch production.

A key strategic question is whether Raise3D can maintain its differentiation as the FDM market matures and competitors close the gap in build volume and material openness. Its expansion into DLP with the DF2 series and high-speed Pro3 HS line suggests an effort to broaden its addressable market beyond FFF prototyping into production applications.