公大激光 closes hundreds of millions RMB Series C led by Dachen Caizhi and Guanghe Chuangtou to scale green laser metal 3D printing for AI computing thermal management

Shenzhen-based Gongda Laser (公大激光) has closed a Series C strategic financing round totaling several hundred million RMB, led by Dachen Caizhi and Guanghe Chuangtou, with participation from Hechuang Zhiyuan (a CICC Xuji fund), Huaxu Fund (a Sany Group affiliate), and Lihua Capital. Existing investor Huachuang Capital also followed on. The company claims to be the world's first to achieve a 4kW quasi-single-mode continuous-wave green laser, which it now ships in volume to the lithium battery, semiconductor, and high-end equipment manufacturing sectors. Its subsidiary, Xihe Additive (希禾增材), will use the capital to accelerate copper-based metal LPBF production, targeting deployment of 1,000 green laser 3D printing machines within three years to become the world's largest dedicated copper-alloy AM capacity base. Over 100 green laser systems are already in customer use, focused on high-thermal-conductivity microchannel liquid-cooled parts for AI chips, copper-based optical module housings for datacom, and rocket combustion chambers for commercial aerospace.

This funding round is significant because it directly ties green laser metal AM to the exploding thermal management demand in AI computing infrastructure. Copper and copper alloys are the preferred materials for heat exchangers and cold plates due to their thermal conductivity, but their high reflectivity at conventional infrared wavelengths (1064 nm) makes them difficult to process reliably with standard LPBF systems. Green lasers (515 nm) absorb far more efficiently on copper surfaces, enabling defect-free builds at higher throughput. Gongda Laser's vertical integration — from the laser source itself to the AM system and process parameters — gives it a structural cost and performance advantage over competitors that rely on third-party green laser modules. The round's investor mix, which includes funds tied to CICC Xuji (a major optical transceiver maker) and Sany Group (heavy equipment), signals that industrial end-users see copper AM as a production tool, not a lab curiosity. The company is positioning itself as the primary hardware and capacity provider for the emerging "AI thermal AM" subsegment, a niche that barely existed two years ago but is now attracting dedicated capital.

From a practical standpoint, Gongda Laser's execution challenge is scaling from 100 to 1,000 machines while maintaining process repeatability across copper alloys such as C18150 and GRCop-84. The company must also build the service-layer credibility — qualification protocols, material certifications, and post-processing workflows — that enterprise AI hardware buyers demand. For the AM industry, this is a rare case where a process innovation (green wavelength) directly unlocks a high-growth, high-value application (AI chip cooling) that cannot be served by incumbent infrared LPBF. The next 18 months will test whether Gongda Laser can convert its laser technology lead into a defensible production footprint before larger AM OEMs develop competing green laser platforms.