
Hans Laser debuts green laser 3D printing for pure copper liquid cooling at World Laser Manufacturing Conference
Hardware
Originally reported by hea.china.com
At the 7th World Laser Manufacturing Conference in Shenzhen, Hans Laser marked its 30th anniversary by unveiling a green laser 3D printing system purpose-built for pure copper liquid cooling plates. The system, developed by subsidiary Hans Laser Juwei, addresses the micro-channel heat dissipation challenge for high-power AI chips. The company also demonstrated a "Laser+AI" architecture using co-source sensing to rebuild the intelligent base of laser equipment, and showcased a red-blue composite laser process for AI liquid cooling precision manufacturing. These announcements came alongside the "Pro Cut" series fiber laser and a new silicon wafer laser dicing saw for photonics.
The green laser 3D printing play is significant because it targets a specific bottleneck in the consumer electronics and AI infrastructure verticals: pure copper thermal management for high-power chips. Pure copper has been notoriously difficult to process with conventional infrared laser powder bed fusion due to its high reflectivity. Hans Laser's green laser approach - using a shorter wavelength to achieve stable absorption in copper - directly attacks that material limitation. This positions the company within the broader metal AM landscape as a materials-process integration play rather than a general-purpose machine vendor. The timing aligns with the rapid qualification cycles in consumer electronics, where Apple has already demonstrated AM for thermal components in the Watch Ultra and iPhone. Hans Laser is effectively offering a production-capable solution for the same class of problem, but aimed at the Chinese and Asian supply chain for AI data center hardware.
From a competitive standpoint, Hans Laser is not a traditional AM OEM - it is a laser source and systems integrator entering the additive space from the photonics side. This gives it a structural advantage in beam control and source-level optimization that pure AM machine builders typically lack. The company claims 85% domestic substitution for its UV/green nanosecond lasers, which suggests it controls its own supply chain for the critical emitter. The real test will be whether it can convert this technical demonstration into repeatable production qualification at a customer site. The AI liquid cooling market is growing fast enough that a validated green laser PBF-LB process for pure copper could become a de facto standard in Asian server thermal management within 18 months.
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