HBD to show 0.15 mm thin-wall copper VC heat spreaders and HBD S200 at TCT Asia 2026

HBD will present metal laser powder bed fusion thermal-management demos at TCT Asia 2026, March 17-19 at the Shanghai National Exhibition and Convention Center, booth 7.1 E35. The lead exhibits are ultra-thin vapor-chamber heat-spreader samples with 0.15 mm high-density walls (density at least 99.95%) and 0.10-0.15 mm porous capillary structures in copper alloy. HBD is also featuring the HBD S200, specified at a spot diameter of 35 um or less, 10 um minimum layer thickness, Ra of 2.2 um or better, +/-0.02 mm accuracy, and 0.06 mm thin-wall forming aimed at cutting post-processing for higher-volume runs.

Fine-feature copper thermal packaging is a concrete consumer-electronics and precision-device use case for metal LPBF, where sealed internal cavities and sub-millimeter walls matter more than large build envelopes. HBD is packaging those geometry claims inside a copper-alloy workflow from design support through post-process validation, not machine specs alone. For thermal-module buyers, the practical test is capillary openness, airtightness, and yield on production copper alloys rather than a single polished booth sample.