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Electroninks

MaterialsAustin, TX, USAFounded 2013· One of 1005 Materials companies tracked by AMPulse

Conductive and functional inks for printed electronics and additive manufacturing

CEO / Founder
S Brett Walker
Team Size
11-50
Stage
Active
Total Funding
$39.5M
Latest Round
Series B
Key Investors
HOLT-CAT, Capital Factory, Bandgap Ventures, Applied Ventures, In-Q-Tel, M Ventures

Technology & Products

Key Products

Silver, gold, platinum, nickel, and copper metal-complex (MOD) inks; product lines CircuitJet (desktop PCB inkjet), CircuitSeed, CircuitShield (EMI), CircuitWrap; copper MOD (2024) plus air-curable Cu-MOD (Jun 2026); UV-curable silver EI-1169 for inkjet/EMI (Jun 2026); UT Dots gold/silver nanoparticle inks via Sigma-Aldrich.

Technological Advantage

Patented particle-free silver ink chemistry, low-temperature sintering, broad substrate compatibility

Differentiation

Value Proposition

Revolutionary particle-free conductive inks enabling new electronics manufacturing approaches

How They Differentiate

Particle-free chemistry enables finer features and lower temperatures than competitors

Market & Competition

Target Customers

Electronics manufacturers, PCB producers, Wearable device makers

Industry Verticals

Consumer Electronics, Wearables, Medical Devices, Aerospace, Automotive

Competitors

DuPont, Henkel, NovaCentrix

Growth & Milestones

Growth Metrics

{"founded": "2013", "employees_mid_2026": 43, "new_products_2026": "EI-1169 UV silver, air-curable Cu-MOD", "afwerx_sbir_2026": "$1.25M", "air_force_rso": "~$1.5M", "key_partnerships_2025_2026": "Insulectro, Merck KGaA, Baba Fine Chemicals, SAKATA INX/SIIX, Sigma-Aldrich"}

Major Milestones

Jul 2026: AFWERX SBIR $1.25M CircuitJet on-demand PCB; Jul 2026: Baba Fine Chemicals India distribution; Jun 2026: SAKATA INX/SIIX Japan partnership; Jun 2026: EI-1169 UV-curable silver + air-curable Cu-MOD launches; May 2026: Sigma-Aldrich UT Dots; Aug 2025: Insulectro & Merck BSM; Sep 2024: Copper MOD SEMICON Taiwan; 2013: UIUC spinout

Notable Customers

Aerospace companies, Defense contractors, Automotive manufacturers, High-tech electronics manufacturers, Semiconductor packaging companies

https://www.electroninks.com

Recent coverage of Electroninks

Why this company matters

AMPulse analysis, not a company disclosure

Electroninks occupies a distinct position in the printed electronics and additive manufacturing materials market by offering particle-free reactive metal inks. Unlike conventional inks that rely on suspended metal particles, its metal organic decomposition (MOD) chemistry allows for ultra-fine feature printing and low-temperature sintering on a broad range of substrates. This approach addresses a key limitation of particle-based inks, which struggle with resolution and require higher thermal budgets.

The company's product portfolio includes silver, gold, platinum, nickel, and copper inks, sold under the CircuitWrap, CircuitShield, and CircuitSeed lines. A particle-free silver ink optimized for aerosol jet printing and a copper MOD ink for advanced semiconductor packaging represent recent additions. These inks are used in applications such as electronic displays, wearable devices, and PCB production. Electroninks also acquired the UTDots nanoinks portfolio, adding gold, silver, and platinum materials to its IP base.

Target customers include electronics manufacturers, PCB producers, and semiconductor packaging companies. Notable partnerships include a North American distribution agreement with Insulectro (August 2025), a backside metallization collaboration with Merck KGaA for semiconductor packaging (August 2025), and a $1.5 million contract with the U.S. Air Force Rapid Sustainment Office for CircuitJet PCB technology. The company has raised $39.5 million from investors including HOLT-CAT, Capital Factory, Bandgap Ventures, and Applied Ventures.

Electroninks competes with established materials suppliers such as DuPont, Henkel, and NovaCentrix. Its differentiation rests on particle-free chemistry that enables finer features and lower sintering temperatures. The key strategic question is whether the MOD ink platform can scale beyond niche applications to displace particle-based inks in high-volume electronics manufacturing, particularly in semiconductor packaging where the copper ink line launched in 2024 targets a demanding cost and reliability threshold.