
Farsoon to show scale-delivery solutions for shoe molds, liquid cooling, and aerospace at Formnext Asia Shenzhen 2026
Hardware
Originally reported by 南极熊
Farsoon will exhibit at Formnext Asia Shenzhen 2026 from August 26-28 in Hall 15, booth B01, under a theme of scenario focus and scale delivery. The Chinese industrial AM OEM plans to present production-oriented applications in consumer electronics (3C), liquid-cooling thermal management, robotics, shoe molds, and commercial aerospace. In shoe molds, Farsoon cites a full-process automated workflow built on its FS450M metal LPBF system that it says has supported sustainable production of more than 1 billion finished pairs of shoes worldwide. On the polymer side, it reports more than 100 SLS systems installed among China's top ten prototype-service customers.
The booth is less a product launch than a restatement of Farsoon's competitive bet: multi-vertical fleet references rather than demo cells. Shoe-mold tooling is the hard commercial anchor-high-volume industrial tooling where automation, utilization, and unit economics decide whether metal LPBF sticks. Liquid cooling and commercial aerospace extend that factory narrative into precision metal and higher-spec demand, while 3C and robotics track faster Asian manufacturing cycles. Buyers comparing Chinese metal and polymer OEMs should use the show to pressure-test those scale claims against real throughput, materials packages, and post-process cost-not the theme language alone.
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