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Farsoon to show scale-delivery solutions for shoe molds, liquid cooling, and aerospace at Formnext Asia Shenzhen 2026
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Farsoon to show scale-delivery solutions for shoe molds, liquid cooling, and aerospace at Formnext Asia Shenzhen 2026

Farsoon Technologies
Farsoon Technologies

Hardware

Originally reported by 南极熊

Farsoon will exhibit at Formnext Asia Shenzhen 2026 from August 26-28 in Hall 15, booth B01, under a theme of scenario focus and scale delivery. The Chinese industrial AM OEM plans to present production-oriented applications in consumer electronics (3C), liquid-cooling thermal management, robotics, shoe molds, and commercial aerospace. In shoe molds, Farsoon cites a full-process automated workflow built on its FS450M metal LPBF system that it says has supported sustainable production of more than 1 billion finished pairs of shoes worldwide. On the polymer side, it reports more than 100 SLS systems installed among China's top ten prototype-service customers.

The booth is less a product launch than a restatement of Farsoon's competitive bet: multi-vertical fleet references rather than demo cells. Shoe-mold tooling is the hard commercial anchor-high-volume industrial tooling where automation, utilization, and unit economics decide whether metal LPBF sticks. Liquid cooling and commercial aerospace extend that factory narrative into precision metal and higher-spec demand, while 3C and robotics track faster Asian manufacturing cycles. Buyers comparing Chinese metal and polymer OEMs should use the show to pressure-test those scale claims against real throughput, materials packages, and post-process cost-not the theme language alone.

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