Fabric8Labs
Fabric8Labs specializes in Electrochemical Additive Manufacturing (ECAM), a room-temperature 3D metal printing technology that produces complex, dense metal parts without the need for post-processing.
- CEO / Founder
- Jeff Herman
- Team Size
- 51-200
- Stage
- Active
- Total Funding
- $123.3M
- Latest Round
- Venture Round
- Key Investors
- New Enterprise Associates (NEA), Intel Capital, Lam Capital, TDK Ventures, SE Ventures, imec.xpand, Stanley Ventures, Mark Cuban, Marunouchi Innovation Partners, SK hynix, Ericsson Ventures, Masco Ventures, Toppan Global Venture Partners
Technology & Products
Key Products
Electrochemical Additive Manufacturing (ECAM) technology for high-resolution, room-temperature 3D metal printing, producing complex, dense metal parts without post-processing.
Technological Advantage
Ability to produce complex, dense metal parts rapidly and cost-effectively, lowering production costs and environmental impact.
Patent position
Fabric8Labs filed 16 patent families in 2022–2024, up 167% from 6 in 2019–2021, while tracked AM filings in the same patent offices fell 33%. AMPulse analysis
- Filing momentum
- 16 families filed 2022–2024, 6 in 2019–2021 (+167%); all tracked AM filings in the same offices -33%
- Focus, 2019–2021 → 2022–2024
- Equipment 100% → 93%
- Filed in
- US 83%WO 10%EP 7%
29 AM patent families in total. Recent years are still being published, so read a filing change against the same-office figure.
Differentiation
Value Proposition
High-resolution, sustainable, and cost-effective metal parts production utilizing a novel room-temperature 3D metal printing process.
How They Differentiate
Fabric8Labs differentiates itself through its novel room-temperature ECAM process, which avoids the high-temperature challenges and costly post-processing of conventional metal 3D printing.
Market & Competition
Target Customers
Industrial manufacturers and semiconductor industry players requiring high-resolution, sustainable, and cost-effective metal parts production
Industry Verticals
Additive Manufacturing, Metal 3D Printing, Semiconductor
Competitors
Other metal additive manufacturing companies
Growth & Milestones
Growth Metrics
Demonstrated strong investor confidence with significant funding rounds and continued scaling efforts.
Major Milestones
Founded in 2015, Raised $19.3M Series A in July 2021, Closed $50M Series B in February 2023, Developing applications for the semiconductor industry, such as 3D printed cold plates
Notable Customers
Information not available
Recent coverage of Fabric8Labs
- TDK acquires Fabric8Labs for up to $400M to scale ECAM for data center thermal managementpulse2.com
- TDK acquires Fabric8Labs for $400M to scale ECAM for data center thermal managementtradingview.com
- Fabric8Labs and University of Illinois develop 3D-printed copper cold plates cutting data center cooling energy by 98%nanjixiong.com
Official records
Filings, certifications, and programme counts AMPulse can show for this company.
- [F] SBIR/STTR · 1 AM award · latest 2020
- [F] Open Call for Innovative Defense-Related Dual-Purpose Technologies/Solutions with a Clear Air Force Stakeholder Need · 2020 · USD 49,671
AM patents
AM-relevant patents linked to this company.
- Patents
- 37
- Granted
- 15
- Families
- 29
Leading domains: process (36), equipment (28), application (5)
Filings by year: 2026: 1 · 2025: 8 · 2024: 9 · 2023: 5 · 2022: 3 · 2021: 2
- ELECTROCHEMICAL ADDITIVE MANUFACTURING SYSTEM HAVING MASKLESS CONDUCTIVE SEED LAYER20250259857 · US
- Wicking Structures and Multiphase Devices for Heat-Transfer20260071827 · US
- MATRIX-CONTROLLED PRINTHEAD FOR AN ELECTROCHEMICAL ADDITIVE MANUFACTURING SYSTEM20240368792 · US
- Electrochemical-deposition system, apparatus, and method using optically-controlled deposition electrodes12252801 · US
- THREE DIMENSIONAL ADDITIVE MANUFACTURING OF METAL OBJECTS BY STEREO-ELECTROCHEMICAL DEPOSITION03377679 · EP
Funding rounds
- Venture Round$50.0M2025-11-01Lead: NEA and Intel Capital
- Series B$50.0M2023-02-01Lead: New Enterprise Associates
- Series A$19.3M2021-07-01Lead: Intel Capital
- Seed$4.0M2018-06-01Lead: Angel Investors