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IQ evolution

HardwareAachen, GermanyFounded 2006· One of 1805 Hardware companies tracked by AMPulse

German additive manufacturing company that designs and produces 3D-printed metal micro coolers for high-power electronics using selective laser melting technology.

CEO / Founder
Dr. Thomas Ebert
Team Size
1-10
Stage
Active
Total Funding
$173K
Latest Round
Grant
Key Investors
Fraunhofer Venture

Technology & Products

Key Products

IQ-Big series (dual-sided cooling >3kW for power modules); IQ-Smart series (TO-247/TO-247+ coolers, 200W-1.4kW); IQ-ThinCooler (0.8mm PCB-integrated cold plates); Direct-to-Chip (D2C) micro coolers for CPU/GPU; Inductor and capacitor coolers; Custom micro cooler prototypes to series production

Technological Advantage

Over 10 years refining 3D metal printing for micro structures; Patented Adaptive Layer Manufacturing for geometries unachievable by conventional methods; Full value chain from prototype to series production; In-house thermal management expertise combined with LPBF process mastery; Thin 0.8mm cold plates enabling PCB-level integration

Differentiation

Value Proposition

3D-printed metal micro coolers for high-power electronics that overcome thermal dissipation limits using patented micro-structure technology, enabling dramatic improvements in cooling efficiency, size reduction, and weight savings compared to conventional cooling solutions.

How They Differentiate

Specialize in 3D-printed micro coolers for power electronics using SLM/LPBF, enabling geometric microstructures impossible with conventional manufacturing. Patented Adaptive Layer Manufacturing technology for extremely thin (0.8mm) cold plates and high-performance micro-channel cooling.

Market & Competition

Target Customers

Power electronics manufacturers; E-mobility OEMs; Data center cooling integrators; Industrial automation companies; High-power laser diode manufacturers; Companies requiring custom thermal management solutions for IGBT modules, transistors, and power semiconductors

Industry Verticals

Power electronics; E-mobility; Data centers; Industrial automation; High-power laser diodes; Renewable energy

Competitors

UniSCool; Cooliblade; Calyos; Wakefield Thermal; Advanced Cooling Technologies

Growth & Milestones

Major Milestones

2006: Founded as spin-off from RWTH Aachen / Fraunhofer by Dr. Thomas Ebert; 2006: Spinout round from Fraunhofer Venture; 2024: Presented IQ-Twin Alu at Formnext; Ongoing: Multiple patents filed for cooling solutions and additive manufacturing processes including Adaptive Layer Manufacturing

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