Skip to main content

Madde

HardwareSeoul, South KoreaFounded 2023· One of 1756 Hardware companies tracked by AMPulse

A deep-tech startup specializing in large-scale metal and high-performance ceramic (Silicon Carbide) 3D printing solutions for advanced industrial manufacturing.

CEO / Founder
Shinhu Cho (Josh Cho)
Team Size
11-50
Stage
Active
Total Funding
$10.0M
Latest Round
Series A
Key Investors
DSC Investment, Schmidt, Atnum Investment, Company K Partners, Intervest, Hyundai Motor Securities

Technology & Products

Key Products

Silicon Carbide (SiC) 3D printing, Metal 3D printing (Wire Arc Additive Manufacturing - WAAM), 3D Printing-based product manufacturing services using SiC and metal materials.

Technological Advantage

Leverages a proprietary Binder Jetting process for ceramics and high-speed robotic Wire Arc Additive Manufacturing (WAAM) for large-scale metal structures, combined with deep R&D roots as a spin-off from Hyundai Motor Group's H-Startup incubator.

Differentiation

Value Proposition

Drastically reduces the cost and lead time for manufacturing complex, high-durability components-particularly Silicon Carbide (SiC) parts-which are traditionally difficult, expensive, and time-consuming to machine.

How They Differentiate

Proprietary Binder Jetting technology specifically optimized for Silicon Carbide (SiC) and high-speed robotic Wire Arc Additive Manufacturing (WAAM) for large-scale metal structures.

Market & Competition

Target Customers

Semiconductor equipment manufacturers, aerospace and satellite companies, Small Modular Reactor (SMR) developers, and automotive OEMs.

Industry Verticals

["Semiconductors","Aerospace & Space","Energy (Small Modular Reactors)","Automotive","Heavy Industry"]

Competitors

Desktop Metal (ExOne); AML3D; InssTek

Growth & Milestones

Growth Metrics

Successfully spun off from Hyundai Motor Group's H-Startup incubator and scaled to a Series A stage within two years of independence.

Major Milestones

["Official spin-off from Hyundai Motor Group in January 2023","Development of the world's first 3D printing system for Silicon Carbide (SiC) semiconductor components","Secured $8.1M Series A funding in January 2025 to advance manufacturing capabilities"]

Notable Customers

Hyundai Motor Group; Semiconductor equipment manufacturers; Participated in CES 2025 as a partner of Hyundai Motor to enter US market

https://www.madde.co.kr

Why this company matters

Madde addresses the difficulty and expense of machining hard, brittle materials like silicon carbide (SiC) by offering additive manufacturing systems and services purpose-built for those materials. The company targets semiconductor equipment makers, aerospace and satellite firms, small modular reactor developers, and automotive OEMs that need complex, high-durability components with shorter lead times and lower cost than traditional machining.

The company's core technologies are a proprietary binder jetting process for ceramics and high-speed robotic wire arc additive manufacturing (WAAM) for large-scale metal structures. Madde claims to have developed the first 3D printing system optimized specifically for SiC semiconductor components, overcoming the material's inherent hardness and fragility. For metals, it uses WAAM to produce large-scale parts.

Madde spun off from Hyundai Motor Group's H-Startup incubator in 2023 and maintains Hyundai Motor Group as a strategic partner. The company has raised approximately $10 million from investors including DSC Investment, Schmidt, Atnum Investment, Company K Partners, Intervest, and Hyundai Motor Securities. It secured an $8.1 million Series A round in January 2025 to advance manufacturing capabilities and participated in CES 2025 as a Hyundai partner to enter the U.S. market.

Competitors include Desktop Metal (ExOne) in binder jetting and AML3D and InssTek in WAAM. Madde's differentiation rests on its proprietary SiC binder jetting process and its combination of ceramic and metal AM capabilities under one roof. The key open question is whether the company can scale production to meet the volume and quality requirements of semiconductor fabs and SMR manufacturers, where qualification cycles are long and defect tolerance is near zero.