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Shenzhen Huayang New Materials Technology

HardwareShenzhen, ChinaFounded 2016· One of 1818 Hardware companies tracked by AMPulse

An industrial-grade metal additive manufacturing company specializing in ultra-large scale SLM (Selective Laser Melting) systems and advanced material printing, such as pure copper for high-performance cooling.

CEO / Founder
Han Xiangyang
Team Size
51-200
Stage
Active
Total Funding
Undisclosed
Latest Round
Series B
Key Investors
投控东海 (Tokong Donghai); 君盛投资; 力合科创; 深圳市天使母基金; 冠达控股; 泓石资本; 四川省川南经济区一体化发展投资基金; 中小担创投; 莞商清大

Technology & Products

Key Products

HY-M Series Metal 3D Printers (HY-M200, M450, M600, M1000, M1500), Ultra-large 10-laser SLM Systems (HY-M1000 with 1200x750x1000mm build size), Pure Copper 3D Printing Solutions (Thermal conductivity >400 W/m·K), Micro-channel Liquid Cooling Plates (MLCP) for AI GPUs and high-power servers, Specialized Metal Powders and Additive Manufacturing Services

Technological Advantage

Proprietary optical path systems and control software that overcome the high reflectivity of copper. Their 'dual-axis over 1 meter' printing capability significantly reduces the need for welding/assembly in aerospace structures.

Differentiation

Value Proposition

Enables the manufacturing of ultra-large, integrated metal components (over 1 meter) and difficult-to-process high-reflectivity materials (Pure Copper) with high precision and thermal efficiency.

How They Differentiate

Pioneering expertise in 'Pure Copper' metal 3D printing, which overcomes high reflectivity issues to achieve thermal conductivity >400 W/m·K. They specialize in ultra-large scale SLM (Selective Laser Melting) with 10+ laser synchronization for integrated aerospace components and high-performance micro-channel liquid cooling for AI GPUs.

Market & Competition

Target Customers

Aerospace manufacturers (rocket engines/satellites), AI hardware/GPU cooling vendors, Semiconductor firms, and Automotive R&D centers.

Industry Verticals

Aerospace & Defense, High-Performance Computing / AI Infrastructure, Semiconductor Manufacturing, Automotive & Energy

Competitors

Bright Laser Technologies (BLT); Farsoon Technologies; Eplus3D; Hanbang Technology (HBD)

Growth & Milestones

Growth Metrics

Operates one of China's largest metal additive manufacturing service bureaus with over 200 industrial machines. Recognized as a National 'Specialized and Sophisticated' (Little Giant) enterprise.

Major Milestones

Founded 2016-09-13 by Han Xiangyang (Tsinghua materials); legal entity Shenzhen Huayang New Materials Technology, HY-M1000 10-laser ultra-large SLM (1200×750×1000 mm) launched 2022; HY-M1500 ultra-large systems, Pure copper SLM / micro-channel liquid cooling for AI GPUs and aerospace thermal structures, Yibin manufacturing subsidiary online end-2023; Jinggangshan subsidiary founded Jan 2025, B+ financing with 投控东海 (Feb 2025); National High-Tech / Specialized & Sophisticated (Little Giant), Showcased large-scale pure copper aerospace components at Beijing commercial aerospace events

Notable Customers

Long-term collaboration reported with AVIC, CASC, CASIC, CASC affiliates, CGN, COMAC, CETC, Harbin Electric, Dongfang Turbine, Huawei, BYD; segments also include molds, automotive, energy/power.

Why this company matters

AMPulse analysis, not a company disclosure

Shenzhen Huayang New Materials Technology occupies a distinctive position in industrial metal additive manufacturing by focusing on two high-difficulty challenges: ultra-large scale SLM systems and reliable printing of pure copper. While many metal AM vendors serve general prototyping or small-series production, Huayang has built its product line around build volumes exceeding one meter and materials with high reflectivity that most laser-based systems cannot process efficiently.

The company's core technology centers on its HY-M Series of SLM printers, ranging from the HY-M200 to the HY-M1500. The HY-M1000 offers a 1200 x 750 x 1000 mm build envelope and synchronizes up to ten lasers for integrated printing of large metal parts. Huayang's proprietary optical path design and control software overcome the reflectivity of pure copper, enabling thermal conductivity above 400 W/m·K in printed components. This capability supports production of micro-channel liquid cooling plates for AI GPUs and high-power servers, as well as monolithic aerospace structures that previously required welding or assembly of multiple smaller parts.

Huayang serves aerospace manufacturers producing rocket engine combustion chambers and satellite structures, AI hardware vendors needing advanced thermal management, and semiconductor equipment makers. The company operates one of China's largest metal AM service bureaus, with over 200 industrial machines, and has completed a Series B funding round backed by Shenzhen High-Tech Investment and industrial technology VCs. Strategic R&D partnerships with Huazhong University of Science and Technology and Southern University of Science and Technology support continued process development.

The company's main competitive risk lies in the rapid scaling of larger Chinese metal AM rivals such as Bright Laser Technologies, Farsoon Technologies, and Eplus3D, all of which also target aerospace and industrial production. Huayang's differentiation depends on maintaining its lead in pure copper printing and ultra-large format SLM, areas where material and process complexity create a higher barrier to entry than standard titanium or aluminum alloys.