Haipulin
Hisense Group subsidiary based in Tianjin manufacturing semiconductor, fiber, and ultrafast laser sources for industrial applications including 3D printing, welding, and cutting.
- CEO / Founder
- Wu Faming
- Stage
- Active
- Latest Round
- Corporate Round
- Key Investors
- Hisense Group (parent company)
Technology & Products
Key Products
High-power fiber laser sources (three product series) for handheld welding, high-power cutting, and 3D printing; targeting monthly output of 10,000 units by Q4 2026
Technological Advantage
Deep technical base in laser display from parent Hisense Group; roadmap toward high-power, narrow-linewidth, and ultrashort-pulse laser sources
Differentiation
Value Proposition
Supplies high-power fiber laser sources across three product lines targeting handheld welding, high-power cutting, and 3D printing, leveraging Hisense's laser display R&D base to enter industrial laser manufacturing.
How They Differentiate
Entrant leveraging a large consumer-electronics parent (Hisense) and laser-display R&D lineage rather than a laser-native startup background
Market & Competition
Target Customers
Industrial equipment integrators and manufacturers in welding, cutting, and additive manufacturing, primarily in China
Industry Verticals
Industrial laser processing, welding, cutting, additive manufacturing
Competitors
Raycus Laser; JPT Opto-electronics; IPG Photonics
Growth & Milestones
Growth Metrics
Targeting monthly production of 10,000 high-power fiber laser units by Q4 2026
Major Milestones
Production base in Tianjin Port Free Trade Zone inaugurated and entered production, June 2026