HS HI-TECH
Provides precision parts manufacturing and additive manufacturing services for semiconductor cleaning equipment and other industrial applications, utilizing metal and polymer 3D printing technologies.
- CEO / Founder
- Lee In O (이인오)
- Team Size
- 51-200
- Stage
- Established
Technology & Products
Key Products
Precision parts for semiconductor cleaning equipment; Metal additive manufacturing services; Polymer additive manufacturing services; Design and material consultation
Technological Advantage
Accumulated know-how in precision parts since 2004, with verified application of metal LPBF and polymer MJF/FDM processes for functional components.
Differentiation
Value Proposition
Leverages over 20 years of precision parts expertise to deliver custom-designed components with reduced lead times and material innovation, particularly for high-value semiconductor cleaning equipment.
How They Differentiate
Specializes in precision parts for semiconductor cleaning equipment with 20+ years of industry-specific expertise, unlike general-purpose AM service bureaus.
Market & Competition
Target Customers
Semiconductor equipment manufacturers, industrial companies requiring precision components
Industry Verticals
Semiconductor; Industrial Manufacturing
Competitors
Proto Labs; Xometry; Sculpteo
Growth & Milestones
Growth Metrics
Reported sales of 20.6 billion KRW (~$15.4M) as of 2017
Major Milestones
Founded in 2004; Joint venture with Z3DLAB formed Z3DFAB digital AM production center; Collaboration with ETH Zurich on Digital Bamboo pavilion project
AM patents
AM-relevant patents linked to this company.
- Patents
- 1
- Granted
- 0
- Families
- 1
Leading domains: material (1)
Filings by year: 2021: 1
- SHELL FOR MOLD, METHOD FOR MANUFACTURING SHELL FOR MOLD, MOLD, METHOD FOR MANUFACTURING MOLD, AND METHOD FOR MANUFACTURING CASTING BY MEANS OF MOLD2023282621 · WO