Houposi
Beijing Houposi Technology is a Chinese materials company founded in 2022 that develops high-energy plasma spheroidization (HEPS) technology to convert irregular metal and ceramic powders into spherical powders for 3D printing, MIM, and semiconductor packaging applications.
- CEO / Founder
- Tang Huangzai (唐皇哉)
- Team Size
- 51-200
- Stage
- Early Stage
Technology & Products
Key Products
Spherical titanium and titanium-alloy powders (via HDH + HEPS "2H" route); spherical tungsten and tantalum powders; high-entropy alloy and TZM alloy powders; spherical tungsten carbide and titanium carbide powders; Low-alpha alumina powder for semiconductor packaging; spherical magnesium oxide powder for thermal-conductive fillers.
Technological Advantage
Proprietary high-energy plasma spheroidization (HEPS) built on first-principles plasma-physics redesign; mid-temperature-zone plasma spheroidization for low-melting-point fine powders (e.g., titanium) to avoid agglomeration and vaporization; multi-temperature-zone coordinated spheroidization for broad particle-size distributions; HDH + HEPS "2H" route enabling full titanium recycling with controlled oxygen content.
Differentiation
Value Proposition
Converts irregular feedstock powders into spherical powders via a proprietary high-energy plasma spheroidization (HEPS) route, targeting lower conversion cost and higher fine-powder recovery than conventional plasma spheroidization for metal AM and MIM feedstock.
How They Differentiate
Positions as an upstream powder-conversion specialist rather than a powder atomizer: it takes irregular feedstock and spheroidizes it via HEPS, emphasizing fine-powder recovery and lower conversion cost, and extends beyond titanium to refractory metals (W, Ta), high-entropy alloys, and TZM.
Market & Competition
Target Customers
Metal AM (LPBF) powder users, MIM producers, aerospace and 3C/consumer-electronics titanium-alloy component makers, and semiconductor packaging material suppliers.
Industry Verticals
Metal additive manufacturing; metal injection molding (MIM); aerospace; 3C/consumer electronics (titanium alloy); semiconductor packaging; thermal management materials.
Competitors
AVIC Metal (中航迈特, spherical titanium powder via gas/plasma atomization); Xi'an Ouzhong Materials (西安欧中材料, plasma rotating electrode process); Sailong / SLMetal (赛隆, microwave plasma powder-making equipment); BLT (铂力特, titanium alloy powders).
Growth & Milestones
Growth Metrics
Team size 20-99 (per Zhaopin job listing); company states it has achieved commercial mass production.
Major Milestones
Founded 2022 with core team from Tsinghua University; developed HEPS high-energy plasma spheroidization technology; achieved commercial mass production of spherical W, Ta, Ti/Ti-alloy, Low-alpha alumina, and other powders; exhibited at TCT Asia 2025 (Booth 8H82); announced a new funding round in progress (March 2025).