MaterialsNorton, Massachusetts, USAFounded 1984· One of 1019 Materials companies tracked by AMPulse
Advanced material solutions including metal matrix composites, hermetic packages, armor products, ultra-low temperature sintered ceramic materials, and the proprietary HybridTech Armor® Metal Matrix Composite technology for high-performance applications.
CEO / Founder
Brian Mackey
Team Size
51-200
Stage
Public
Total Funding
$37.3M
Latest Round
Grant
Key Investors
U.S. Department of Energy (SBIR), U.S. Army (STTR), Government Research Grants
Technology & Products
Key Products
CPS Technologies Corporation provides advanced material solutions including metal matrix composites (AlSiC), hermetic packages, and armor products. These are used in transportation, energy, aviation, defense, and oil & gas industries. Specific products include microprocessor lids, flip chip lids, heat sinks, microwave housings, optoelectronic housings, power substrates, and IGBT baseplates.
Technological Advantage
Utilizes cutting-edge additive manufacturing techniques, binder jet technology, and unique composite formulations to produce lightweight yet durable materials.
Differentiation
Value Proposition
Delivers lightweight, high-performance advanced materials that enhance efficiency, durability, and safety in critical applications.
How They Differentiate
Specializes in a niche of high-performance composites and hermetic packaging solutions with proprietary technology tailored for military and industrial applications.
Market & Competition
Target Customers
Companies in microelectronics, aerospace, defense, automotive, energy, and transportation sectors
Reported record annual revenue of $27.6 million in 2023
Major Milestones
Awarded Army Phase I SBIR contract for advanced manufacturing solutions, Secured DOE Phase II SBIR contract and multiple SBIR awards totaling over $3 million, Received first commercial order for radiation shielding materials, Achieved significant revenue milestones in 2023
Notable Customers
CPS Technologies serves multinational companies in high-speed rail, wind turbines, EV/HEV applications, and aerospace and satellite industries. They have received significant orders from key customers for AlSiC baseplates for use in Traction and HEV/EV markets.
CPS Technologies Corporation occupies a niche position in advanced materials, specializing in metal matrix composites (MMCs) such as aluminum silicon carbide (AlSiC) and proprietary HybridTech Armor®. The company focuses on applications where thermal conductivity, coefficient of thermal expansion matching, and weight reduction are critical — primarily in power electronics, defense, and high-speed rail. Unlike broad-based composites suppliers, CPS concentrates on hermetic packaging and armor solutions for mission-critical environments.
The company's core technology centers on AlSiC metal matrix composites, produced through processes that include binder jetting and other additive manufacturing techniques. Key products include microprocessor lids, flip chip lids, heat sinks, microwave housings, optoelectronic housings, power substrates, and IGBT baseplates. CPS also produces ultra-low temperature sintered ceramic materials and holds IP related to multi-layer metal matrix composite armor with edge protection and cooling systems for high-power heat-generating devices.
CPS serves customers in microelectronics, aerospace, defense, automotive, energy, and transportation. Notable application areas include traction inverters for high-speed rail, wind turbine power modules, EV/HEV power electronics, and satellite housings. The company has received significant orders for AlSiC baseplates used in traction and HEV/EV markets. Partnerships include Texas A&M University and U.S. defense agencies including the Army, Navy, and Department of Energy.
The company reported record annual revenue of $27.6 million in 2023 and has raised approximately $26.95 million in funding, primarily through government SBIR and STTR grants. CEO Brian Mackey brings over 20 years of executive experience from manufacturing and technology companies. Competitive risks include the potential for alternative thermal management materials such as copper-diamond composites or advanced ceramics to erode AlSiC's cost-performance advantage in power electronics.