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Dongwon Parts

HardwareSiheung-si, Gyeonggi-do, South KoreaFounded 1997· One of 1738 Hardware companies tracked by AMPulse

South Korean manufacturer of high-precision semiconductor equipment components (chambers, showerheads) that is extending its one-stop machining, joining, surface-treatment and cleaning capabilities into metal additive manufacturing for aerospace and defense parts.

CEO / Founder
Cho Deok-hyung (조덕형)
Team Size
201-500
Stage
Growth Stage
Latest Round
Bootstrapped
Key Investors
Samsung Venture Investment (via SVIC43 New Technology Investment Fund, ~5.5% stake)

Technology & Products

Key Products

Semiconductor process components including process chambers and showerheads (gas distribution); heaters; precision micro-hole drilling; special joining (FSW, E-beam, brazing, TIG, laser); heat treatment; dry/wet polishing; soft & hard anodizing; precision cleaning (chemical polishing, DI water, ultrasonic); cleanroom assembly (Class 100-10,000); CMM inspection; Rapid Prototype Solution (RPS) 24-hour prototyping; metal 3D-printed aerospace parts with integrated post-processing.

Technological Advantage

End-to-end in-house production chain from raw material to cleanroom assembly; proprietary ultra-precision micro-hole drilling; integrated post-processing of additively manufactured metal parts; process-by-process inspection and production traceability; InnoBiz and venture-company certifications.

Differentiation

Value Proposition

A fully integrated "One-Stop Solution" that keeps design, raw material, machining, welding/joining, heat treatment, polishing, anodizing, cleaning and cleanroom assembly in-house, reducing handoff risk, shortening lead times and delivering consistent quality for complex, hard-to-machine semiconductor and aerospace components.

How They Differentiate

Differentiates through a single-site, fully integrated production structure (material supply through cleanroom assembly and inspection) rather than discrete machining only, plus semiconductor-grade cleanliness and traceability discipline applied to metal AM post-processing.

Market & Competition

Target Customers

Semiconductor equipment OEMs (global and domestic), display and medical device equipment makers, and emerging aerospace/defense primes and MRO providers.

Industry Verticals

Semiconductor equipment; display; medical devices; aerospace and defense (emerging); custom precision manufacturing.

Competitors

Domestic and international semiconductor equipment component suppliers such as HS Hi-Tech (Korea), and other precision-machining/parts makers serving Lam Research, Applied Materials and Korean OEMs; in metal AM aerospace, established AM service providers and OEM-qualified suppliers.

Growth & Milestones

Growth Metrics

2025 consolidated revenue ₩92.3B (~$67M) with operating profit ₩7.6B, up roughly sevenfold year-on-year; equity ~₩27.5B; ~290-338 employees; pursuing KOSDAQ IPO (927,328 shares planned, ~21.8% offered) led by Samsung Securities.

Major Milestones

Founded 1997; EOS metal 3D printing MOU (Dec 2022); completed Korean Air supplier registration; submitted KOSDAQ preliminary listing review application (Aug 6, 2026); cleared KOSDAQ listing review in record 26 business days (Sept 14, 2026); exhibiting semiconductor-grade precision machining and metal 3D-printed aerospace components at AEROTEC 2026 (Sept 30-Oct 2, Changwon).

Notable Customers

Lam Research; Applied Materials; four of Korea's top-10 semiconductor equipment makers by revenue.

Recent coverage of Dongwon Parts

AM patents

AM-relevant patents linked to this company.

Patents
1
Granted
1
Families
1

Leading domains: equipment (1), process (1)

Filings by year: 2023: 1

  1. 베이스 플레이트의 제조방법1028805630000 · KR