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EML

MaterialsSuwon, South KoreaFounded 2018· One of 1000 Materials companies tracked by AMPulse

A total solution provider for advanced alloy materials and additive manufacturing, specializing in the localization of high-purity spherical metal powders and industrial 3D printing equipment.

CEO / Founder
Eunsoo Park
Team Size
51-200
Stage
Growth Stage
Total Funding
$13.1M
Latest Round
Venture Round
Key Investors
SBI Investment Korea, Yuanta Investment, Korea Credit Guarantee Fund (신용보증기금)

Technology & Products

Key Products

EML specializes in high-purity spherical metal powders and industrial 3D printing equipment, utilizing proprietary EIGA and VIGA technology to reduce impurities by over 20% for aerospace and semiconductor applications.

Technical position · AMPulse analysis

Utilizes a proprietary AI-based process optimization system that analyzes accumulated atomization data to ensure high-yield, high-cleanliness spherical powders. Their materials exhibit up to 3x higher strength and 5x higher elasticity compared to standard industrial alloys.

Patent position

Patent families filed fell -33%, from 6 in 2019-2021 to 4 in 2022-2024, while tracked AM filings in the same patent offices fell -36%. EML holds 11 families in total against 75 for Carpenter Technology. AMPulse analysis

Filing momentum
4 families filed 2022–2024, 6 in 2019–2021 (-33%); all tracked AM filings in the same offices -36%
Filed in
KR 82%US 18%
Named competitors, AM patent families
Carpenter Technology 75

11 AM patent families in total. Recent years are still being published, so read a filing change against the same-office figure.

Differentiation

Value Proposition

Reduces dependency on imported high-end metal powders by providing a domestic 'Total Solution' that integrates material science, part manufacturing, and equipment production, resulting in higher material purity and superior mechanical properties.

How They Differentiate

EML differentiates itself through its proprietary 'Total Solution' model, designing and manufacturing its own powder production equipment (Atomizers) and AI-optimized processing systems. Their EIGA and VIGA technology reduces impurities by over 20%, meeting rigorous standards for aerospace and semiconductor applications, allowing for higher purity and molecular-level alloy customization.

Market & Competition

Target Customers

Industrial manufacturers in high-precision sectors such as aerospace, defense, nuclear energy, and semiconductors.

Industry Verticals

Aerospace & Aviation, Defense, Nuclear Energy, Semiconductors, Medical Implants

Competitors

Hana AM (하나에이엠); K-Materials; Carpenter Technology; Samyang (AM Division)

Growth & Milestones

Growth Metrics

Reported revenue of approximately 16.54B KRW (~$12M) for 2025, with ~90–97 employees (Saramin/Incruit 2026).

Major Milestones

Founded Dec 2018 by Dr. Eunsoo Park (ex-Samsung/KITECH), Successfully localized high-purity spherical metal powders for aerospace/semiconductor, Secured 5.0B KRW investment from KODIT, SBI Investment, Yuanta Investment (2022–2023), Awarded '3 Million Dollar Export Tower' by KITA (Dec 2023), Selected for DIPS 1000+ Deep-tech Startup (MSS), Signed IPO underwriting with Shinhan Investment Securities (2026), KS Q 9100 aerospace quality certification (Mar 2026), Third-party convertible preferred raise ~USD 9.2M (Jun 2026)

Notable Customers

Samsung Electronics; Hanwha Aerospace; Korea Institute of Industrial Technology (KITECH); KAIST

Recent coverage of EML

AM patents

AM-relevant patents linked to this company.

Patents
11
Granted
7
Families
11

Leading domains: material (11), process (10), equipment (2)

Filings by year: 2023: 3 · 2022: 1 · 2021: 2 · 2020: 3 · 2019: 1 · 2017: 1

  1. Mo-Ti 실린더 일체형 타겟 및 그 제조 방법1030011850000 · KR
  2. 3D 프린팅을 이용한 다이아몬드 적층 방법1024525590000 · KR
  3. 적층 제조용 고경도 합금 소재 및 그에 따른 부품1028437840000 · KR
  4. METAL POWDER MANUFACTURING SYSTEM20250065402 · US
  5. 3D 프린팅을 이용한 고효율 Zr계 실린더형 합금타겟 제조방법1023708350000 · KR

Funding rounds

  • Venture Round$9.2M2026-06Source
  • Series A$3.7M (50억 KRW)2022-12Source
  • SeedUndisclosed2019-01Source: Innoforest