EngeniusMicro
Provides precision additive manufacturing services and multi-process AM systems for aerospace and defense, specializing in ceramic packaging and electronics.
- CEO / Founder
- Michael Kranz
- Team Size
- 11-50
- Stage
- Established
- Total Funding
- $350K
- Latest Round
- Grant
- Key Investors
- U.S. Department of Energy; United States Department of War; US National Science Foundation; Innovate Alabama
Technology & Products
Key Products
emu multi-process additive manufacturing system; Additive electronics (drop-on-demand printing); Ceramic packages; MEMS sensors; RF components
Technological Advantage
EngeniusMicro specializes in advanced multi-chip module (MCM) packaging engineered for austere environments and RF technologies supporting next-generation defense, energy, and space systems. The company combines expertise in microelectronics and MEMS with innovative additive manufacturing technologies to enable rapid prototyping and agile development, delivering proven performance in harsh environments.
Differentiation
Value Proposition
Enables fabrication of intricate ceramic packages and multi-material electronics with exacting placement, reducing lead times and enabling on-demand production for mission-critical systems.
Market & Competition
Target Customers
Federal government, defense and aerospace contractors
Industry Verticals
Aerospace; Defense; Government
Competitors
MEI Micro, Sporian Microsystems, and Silicon MicroGravity
Growth & Milestones
Growth Metrics
Revenue estimated at $21.5M ARR in 2024; 114% growth over 3 years (Inc. 5000 2021); 25-50 employees
Major Milestones
2007: Founded; 2021: Inc. 5000 list (114% growth); 2024: Revenue estimated at $21.5M ARR; 2025: Received $999,999 SBIR award from U.S. Department of the Navy; 2025: Received $137,336 award from Northeast Microelectronics Coalition
Funding rounds
- Grant$150K2024-01Source: ZoomInfo
- Grant$200K2023-08Lead: Innovate Alabama · Source: PitchBook