Hongrida
Shenzhen ChiNext-listed (301285) Kunshan maker of precision connectors and structural parts for phones, PCs and automotive, which has added metal 3D printer development and printed-part production.
- CEO / Founder
- Wang Yutian (王玉田)
- Team Size
- 1001-5000
- Stage
- Public
- Total Funding
- $106M
- Latest Round
- IPO
- Key Investors
- Dongwu Securities (IPO sponsor)
Technology & Products
Key Products
Mobile, PC and automotive connectors; precision structural parts and molds; dual-laser and six-laser metal 3D printers (titanium, steel, aluminum); 3D-printed consumer electronics structural parts and chip cooling modules.
Technical position · AMPulse analysis
Over 200 patents held by the company and its subsidiaries; in-house testing laboratory; automated production lines; established qualification relationships with consumer electronics customers.
Differentiation
Value Proposition
Full-process in-house capability from 3D printer development through part printing to back-end machining and finishing, aimed at consumer electronics and semiconductor heat-dissipation parts.
How They Differentiate
Competes as an electronics parts manufacturer with captive downstream customers and finishing processes, rather than as a pure machine vendor.
Market & Competition
Target Customers
Consumer electronics and computer OEMs, automotive electronics, semiconductor packaging and optical communication customers.
Industry Verticals
Consumer electronics; computing; automotive electronics; semiconductor packaging; optical communications; wearables.
Competitors
Bright Laser Technologies (铂力特); Farsoon Technologies (华曙高科); Eplus3D (易加三维)
Growth & Milestones
Growth Metrics
Revenue around RMB 1B per press reports; 1,648 employees (Sohu company profile, 2020 figure); total share capital 207M shares.
Major Milestones
2003 founded; Sep 2022 listed on Shenzhen ChiNext (301285); Dec 2025 Lenovo Motorola 3D printing joint lab; 19 Oct 2026 set up wholly owned subsidiary Hunan Hongyu Additive Materials Technology Co., Ltd. (RMB 10M registered capital) for additive manufacturing equipment manufacturing and sales.
Notable Customers
Lenovo Motorola (3D printing joint lab); consumer electronics and computer customers receiving samples and small-batch deliveries.
Recent coverage of Hongrida
AM patents
AM-relevant patents linked to this company.
- Patents
- 1
- Granted
- 0
- Families
- 1
Leading domains: material (1), process (1)
Filings by year: 2026: 1
- Efficient liquid cooling heat dissipation device and manufacturing method thereof121888573 · CN
Funding rounds
- IPO¥754M2022-09Lead: Dongwu Securities · Source