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Sheridan Solutions

ApplicationSaline, MI, USA· One of 686 Application companies tracked by AMPulse

Develops ultrasonic additive manufacturing (UAM) processes for high-performance heat exchangers and embedded sensors for aerospace applications, reducing part count and improving thermal performance.

CEO / Founder
John Sheridan
Team Size
1-10
Stage
Early Stage
Total Funding
At least $124,999 from NASA SBIR Phase I (June 2015)
Latest Round
NASA SBIR Phase I grant (June 2015, $124,999) - the only funding round identified
Key Investors
NASA (via SBIR/STTR program)

Technology & Products

Key Products

Ultrasonic additive manufacturing heat exchangers; Embedded fiber optic strain sensors in metal parts

Technological Advantage

Proprietary UAM process enables embedding sensors and creating complex internal geometries at low temperatures, preserving material properties; protected by trade secrets and NASA contracts.

Differentiation

Value Proposition

Enables production of complex metal parts with embedded sensors and internal channels via UAM, reducing weight and improving thermal management compared to conventional manufacturing.

How They Differentiate

Focus on UAM for heat exchangers and embedded sensors, leveraging NASA-funded R&D.

Market & Competition

Target Customers

NASA, aerospace OEMs, defense contractors

Industry Verticals

Aerospace; Defense; Nuclear

Competitors

Fabrisonic LLC

Growth & Milestones

Growth Metrics

NASA SBIR Phase I award (2015); technology featured in NASA Spinoff article; one customer producing over 70,000 parts in-house; technology being adopted for Earth applications

Major Milestones

Awarded multiple NASA SBIR/STTR contracts for UAM heat exchangers; Developed UAM process for embedding fiber optic sensors

Notable Customers

NASA