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UHV Technologies

HardwareFort Wayne, IN, USAFounded 1994· One of 1733 Hardware companies tracked by AMPulse

Develops a low-temperature 3D Metal Printer for in-space additive manufacturing of metals and alloys, leveraging a 30-year R&D base in vacuum systems, thin-film deposition, and ML/AI software.

CEO / Founder
Nalin Kumar
Team Size
1-10
Stage
Active
Total Funding
$8.8M
Latest Round
Grant
Key Investors
ARPA-E; U.S. Department of Energy

Technology & Products

Key Products

3D Metal Printer; Metal Sorter; XRF/LIBS Analyzers; Vacuum Coating Systems

Technological Advantage

Proprietary low-temperature metal AM process for in-space and industrial use, supported by 62 patents held by the founder and a 30-year history of SBIR/STTR and ARPA-E funded R&D. The advantage is protectable via trade secrets and patent portfolio.

Differentiation

Value Proposition

Enables low-temperature metal AM for space and industrial applications, reducing energy requirements and expanding printable alloy ranges, backed by a 30-year track record in physical sciences R&D and government-funded innovation.

How They Differentiate

Focuses on low-temperature metal AM for space applications, unlike room-temperature or high-temperature processes, leveraging a broader R&D foundation in vacuum and thin-film technologies.

Market & Competition

Target Customers

NASA, aerospace primes, research institutions, and industrial manufacturers requiring advanced metal AM equipment and materials.

Industry Verticals

Aerospace; Defense; Recycling; Research

Competitors

Fabric8Labs; Exaddon AG

Growth & Milestones

Major Milestones

Relocated HQ to Lexington, KY in 2015; Selected as NASA TechPort industry participant for in-space additive manufacturing project; Received ARPA-E award for highly efficient vacuum smelting of aluminum

Notable Customers

NASA

Funding rounds

  • Grant$200K2023-07-10Lead: U.S. Department of Energy · Source
  • Grant$3.32M2014-01-01Lead: ARPA-E · Source