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Chengdu Zengyi Technology

HardwareChengdu, ChinaFounded 2023· One of 1733 Hardware companies tracked by AMPulse

Develops industrial-grade Binder Jetting (BJ) additive manufacturing systems designed for high-volume production of complex metal and ceramic components.

CEO / Founder
Dai Yuhong
Team Size
1-10
Stage
Active
Total Funding
$13.8M
Latest Round
Series A
Key Investors
Chengdu Jinkong; Sichuan Development Holding; Chengdu Industry Investment; Zhongke Chuangxing

Technology & Products

Key Products

J200 Binder Jetting 3D Printer; J450 Industrial Binder Jetting System; J450T High-Efficiency BJ System; Specialized metal binders; Post-processing curing ovens

Technological Advantage

Claimed: High-speed printing with large build volumes (J450) and high precision. Verified: Patent CN222223487U for printhead self-check/self-cleaning system (applied 2024-04), supporting industrial uptime; additional powder-feed and BJ process patents under 成都增谊科技.

Differentiation

Value Proposition

Enables mass production of complex metal parts with high material utilization and speed, reducing per-part costs by up to 50-80% compared to laser-based metal 3D printing for high-volume industrial applications.

How They Differentiate

Offers localized, cost-competitive large-format Binder Jetting systems (J450) with proprietary printhead maintenance technology that reduces operational downtime compared to international competitors.

Market & Competition

Target Customers

Industrial manufacturers in automotive, aerospace, and consumer electronics requiring low-cost, high-volume production of complex metal geometries.

Industry Verticals

Aerospace; Automotive; Consumer Electronics; Tooling; Medical

Competitors

Desktop Metal; EasyMFG (Wuhan Yizhi); Longyuan AFS (Beijing Longyuan)

Growth & Milestones

Growth Metrics

Launched J450 system in 2024-06 (official site); Included on Xindu District 2025 Q1 innovative SME recommended list; HQ/production at 新都区工业东区创业路69号3栋; active Formnext Asia / TCT Asia exhibitor 2025

Major Milestones

2023-12: Company registered (成都增谊科技有限公司); 2023: First industrial BJ equipment developed (company news); 2024-06: Launched J450 next-generation BJ system; 2025: Listed among Xindu innovative SMEs; active TCT/Formnext Asia exhibitor

Notable Customers

Beijing Tongrentang (Sichuan) Health Pharmaceutical Co., Ltd.; Sichuan Additive Manufacturing Technology Association; Sichuan Virgin High-tech Materials Co., Ltd.; Sichuan Mechanical Research and Design Institute; Sichuan University of Science and Engineering; Sichuan University

AM patents

AM-relevant patents linked to this company.

Patents
7
Granted
4
Families
7

Leading domains: process (7), equipment (2), material (2)

Filings by year: 2025: 2 · 2024: 5

  1. A pyrolysis and pickling composite method for 3D printing recycled stainless steel powder118832158 · CN
  2. A method for evaluating surface quality of 3D printed products118261913 · CN
  3. A method, system and storage medium for judging sample boundary quality119006477 · CN
  4. A 3D printing device and cleaning method for powder materials120503420 · CN
  5. A device capable of adjusting inkjet volume and inkjet resolution3DPrinting head and printing method118082189 · CN

Funding rounds

  • Series A$13.8M2024-01Lead: Chengdu Jinkong · Source: 36Kr
  • Pre-Series A2022-06Source: ITJuzi
  • Angel2021-03Source: Web